TongFu Microelectronics Co Ltd (002156) - Total Assets
Based on the latest financial reports, TongFu Microelectronics Co Ltd (002156) holds total assets worth CN¥45.47 Billion CNY (≈ $6.65 Billion USD) as of September 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. Check TongFu Microelectronics Co Ltd cash flow reinvestment rate to assess the company's total reinvestment commitment from operating cash flow.
TongFu Microelectronics Co Ltd - Total Assets Trend (2004–2024)
This chart illustrates how TongFu Microelectronics Co Ltd's total assets have evolved over time, based on quarterly financial data. Explore 002156 strategic capital deployment ratio to see how much of total assets are deployed in long-term investments.
TongFu Microelectronics Co Ltd - Asset Composition Analysis
Current Asset Composition (December 2024)
TongFu Microelectronics Co Ltd's total assets of CN¥45.47 Billion consist of 35.6% current assets and 64.4% non-current assets.
| Asset Category | Amount (CNY) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 10.8% |
| Accounts Receivable | CN¥5.98 Billion | 15.2% |
| Inventory | CN¥3.35 Billion | 8.5% |
| Property, Plant & Equipment | CN¥0.00 | 0.0% |
| Intangible Assets | CN¥344.81 Million | 0.9% |
| Goodwill | CN¥1.15 Billion | 2.9% |
Asset Composition Trend (2004–2024)
This chart illustrates how TongFu Microelectronics Co Ltd's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see TongFu Microelectronics Co Ltd market cap and net worth.
Key Asset Composition Facts
- Current vs. Non-Current Assets: TongFu Microelectronics Co Ltd's current assets represent 35.6% of total assets in 2024, a decrease from 40.0% in 2004.
- Cash Position: Cash and equivalents constituted 10.8% of total assets in 2024, down from 12.6% in 2004.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 2.0% of total assets, unchanged from 2.0% in 2004.
- Asset Diversification: The largest asset category is accounts receivable at 15.2% of total assets.
TongFu Microelectronics Co Ltd Competitors by Total Assets
Key competitors of TongFu Microelectronics Co Ltd based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
Skyverse Technology Co. Ltd. A
SHG:688361
|
China | CN¥8.03 Billion |
|
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401
|
China | CN¥3.18 Billion |
|
KoMiCo Ltd
KQ:183300
|
Korea | ₩926.26 Billion |
|
D I Corp
KO:003160
|
Korea | ₩382.20 Billion |
|
Semco Technologies Sas
PA:ALSEM
|
France | €35.29 Million |
|
Hisem Co Ltd
KQ:200470
|
Korea | ₩162.58 Billion |
|
New Power Plasma Co.Ltd
KQ:144960
|
Korea | ₩998.38 Billion |
|
Bluglass Ltd
AU:BLG
|
Australia | AU$16.84 Million |
TongFu Microelectronics Co Ltd - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 0.91 | 1.03 | 1.23 |
| Quick Ratio | 0.66 | 0.76 | 1.03 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | CN¥-1.43 Billion | CN¥354.45 Million | CN¥1.65 Billion |
TongFu Microelectronics Co Ltd - Advanced Valuation Insights
This section examines the relationship between TongFu Microelectronics Co Ltd's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 4.85 |
| Latest Market Cap to Assets Ratio | 0.39 |
| Asset Growth Rate (YoY) | 12.8% |
| Total Assets | CN¥39.34 Billion |
| Market Capitalization | $15.16 Billion USD |
Valuation Analysis
Below Book Valuation: The market values TongFu Microelectronics Co Ltd's assets below their book value (0.39x), which may indicate investor concerns about asset quality or future growth.
Rapid Asset Growth: TongFu Microelectronics Co Ltd's assets grew by 12.8% over the past year, indicating significant expansion of the company's resource base.
Annual Total Assets for TongFu Microelectronics Co Ltd (2004–2024)
The table below shows the annual total assets of TongFu Microelectronics Co Ltd from 2004 to 2024.
| Year | Total Assets | Change |
|---|---|---|
| 2024-12-31 | CN¥39.34 Billion ≈ $5.76 Billion |
+12.79% |
| 2023-12-31 | CN¥34.88 Billion ≈ $5.10 Billion |
-2.11% |
| 2022-12-31 | CN¥35.63 Billion ≈ $5.21 Billion |
+31.47% |
| 2021-12-31 | CN¥27.10 Billion ≈ $3.97 Billion |
+27.65% |
| 2020-12-31 | CN¥21.23 Billion ≈ $3.11 Billion |
+31.40% |
| 2019-12-31 | CN¥16.16 Billion ≈ $2.36 Billion |
+15.67% |
| 2018-12-31 | CN¥13.97 Billion ≈ $2.04 Billion |
+15.00% |
| 2017-12-31 | CN¥12.15 Billion ≈ $1.78 Billion |
+8.42% |
| 2016-12-31 | CN¥11.20 Billion ≈ $1.64 Billion |
+72.04% |
| 2015-12-31 | CN¥6.51 Billion ≈ $952.90 Million |
+64.65% |
| 2014-12-31 | CN¥3.96 Billion ≈ $578.75 Million |
+7.29% |
| 2013-12-31 | CN¥3.69 Billion ≈ $539.41 Million |
+8.98% |
| 2012-12-31 | CN¥3.38 Billion ≈ $494.95 Million |
-0.23% |
| 2011-12-31 | CN¥3.39 Billion ≈ $496.10 Million |
-6.71% |
| 2010-12-31 | CN¥3.63 Billion ≈ $531.80 Million |
+73.41% |
| 2009-12-31 | CN¥2.10 Billion ≈ $306.67 Million |
+11.81% |
| 2008-12-31 | CN¥1.87 Billion ≈ $274.27 Million |
-9.68% |
| 2007-12-31 | CN¥2.08 Billion ≈ $303.68 Million |
+44.23% |
| 2006-12-31 | CN¥1.44 Billion ≈ $210.55 Million |
+15.05% |
| 2005-12-31 | CN¥1.25 Billion ≈ $183.00 Million |
+29.63% |
| 2004-12-31 | CN¥964.73 Million ≈ $141.17 Million |
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About TongFu Microelectronics Co Ltd
Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more