TongFu Microelectronics Co Ltd Total Liabilities
TongFu Microelectronics Co Ltd total liabilities. Based on the latest financial reports, TongFu Microelectronics Co Ltd (002156) has total liabilities worth CN¥28.67 Billion CNY (≈ $4.19 Billion USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check asset resilience ratio of TongFu Microelectronics Co Ltd to evaluate the company's liquid asset resilience ratio.
Total Liabilities of TongFu Microelectronics Co Ltd (2004–2024)
Total liabilities of TongFu Microelectronics Co Ltd from 2004 to 2024. This chart illustrates how TongFu Microelectronics Co Ltd's total liabilities have evolved over time, based on quarterly financial data. Explore investment intensity of TongFu Microelectronics Co Ltd to see how much of total assets are deployed in long-term investments.
TongFu Microelectronics Co Ltd Competitors by Total Liabilities
The table below lists competitors of TongFu Microelectronics Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Ningbo Zhoushan Port Co Ltd
SHG:601018
|
China | CN¥33.30 Billion |
|
Deutsche Lufthansa AG
F:LHAB
|
Germany | €36.68 Billion |
|
AtkinsRealis Group Inc
TO:ATRL
|
Canada | CA$6.99 Billion |
|
Ryder System Inc
NYSE:R
|
USA | $13.22 Billion |
|
CSPC Pharmaceutical Group Limited
F:CVG
|
Germany | €12.15 Billion |
|
Medibank Private Ltd
AU:MPL
|
Australia | AU$1.92 Billion |
|
Banque Cantonale Vaudoise
SW:BCVN
|
Switzerland | CHF57.64 Billion |
|
Aegon NV
AS:AGN
|
Netherlands | €301.25 Billion |
Liability Composition Analysis (2004–2024)
This chart breaks down TongFu Microelectronics Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see TongFu Microelectronics Co Ltd (002156) total assets.
Liquidity & Leverage Metrics
TongFu Microelectronics Co Ltd Total Liabilities Ratios Explained
TongFu Microelectronics Co Ltd total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.91 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.89 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.63 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how TongFu Microelectronics Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for TongFu Microelectronics Co Ltd (2004–2024)
The table below shows the annual total liabilities of TongFu Microelectronics Co Ltd from 2004 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥23.63 Billion ≈ $3.46 Billion |
+17.07% |
| 2023-12-31 | CN¥20.18 Billion ≈ $2.95 Billion |
-4.19% |
| 2022-12-31 | CN¥21.07 Billion ≈ $3.08 Billion |
+31.03% |
| 2021-12-31 | CN¥16.08 Billion ≈ $2.35 Billion |
+43.36% |
| 2020-12-31 | CN¥11.22 Billion ≈ $1.64 Billion |
+16.17% |
| 2019-12-31 | CN¥9.65 Billion ≈ $1.41 Billion |
+29.32% |
| 2018-12-31 | CN¥7.47 Billion ≈ $1.09 Billion |
+26.79% |
| 2017-12-31 | CN¥5.89 Billion ≈ $861.62 Million |
+16.34% |
| 2016-12-31 | CN¥5.06 Billion ≈ $740.64 Million |
+82.62% |
| 2015-12-31 | CN¥2.77 Billion ≈ $405.57 Million |
+74.25% |
| 2014-12-31 | CN¥1.59 Billion ≈ $232.75 Million |
+11.22% |
| 2013-12-31 | CN¥1.43 Billion ≈ $209.26 Million |
+21.84% |
| 2012-12-31 | CN¥1.17 Billion ≈ $171.75 Million |
-2.97% |
| 2011-12-31 | CN¥1.21 Billion ≈ $177.01 Million |
-19.46% |
| 2010-12-31 | CN¥1.50 Billion ≈ $219.78 Million |
+45.81% |
| 2009-12-31 | CN¥1.03 Billion ≈ $150.73 Million |
+18.54% |
| 2008-12-31 | CN¥868.93 Million ≈ $127.15 Million |
-20.23% |
| 2007-12-31 | CN¥1.09 Billion ≈ $159.39 Million |
+0.63% |
| 2006-12-31 | CN¥1.08 Billion ≈ $158.40 Million |
+10.63% |
| 2005-12-31 | CN¥978.43 Million ≈ $143.18 Million |
+31.80% |
| 2004-12-31 | CN¥742.34 Million ≈ $108.63 Million |
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About TongFu Microelectronics Co Ltd
Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more