TongFu Microelectronics Co Ltd (002156) - Total Liabilities
Based on the latest financial reports, TongFu Microelectronics Co Ltd (002156) has total liabilities worth CN¥28.67 Billion CNY (≈ $4.19 Billion USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
TongFu Microelectronics Co Ltd - Total Liabilities Trend (2004–2024)
This chart illustrates how TongFu Microelectronics Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See working capital position of TongFu Microelectronics Co Ltd to evaluate short-term liquidity relative to the company's equity base.
TongFu Microelectronics Co Ltd Competitors by Total Liabilities
The table below lists competitors of TongFu Microelectronics Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
AB Volvo (publ)
ST:VOLV-A
|
Sweden | Skr491.70 Billion |
|
Sprott Physical Gold Trust
TO:PHYS
|
Canada | CA$6.27 Million |
|
Mueller Industries Inc
NYSE:MLI
|
USA | $581.53 Million |
|
HAIER SM.HME UNSP.ADR/4
F:HAI0
|
Germany | €165.78 Billion |
|
Generac Holdings Inc
NYSE:GNRC
|
USA | $2.92 Billion |
|
Vodacom Group Ltd
JSE:VOD
|
South Africa | ZAC169.20 Billion |
|
Genuine Parts Co
NYSE:GPC
|
USA | $15.89 Billion |
|
LATAM Airlines Group S.A.
NYSE:LTM
|
USA | $16.78 Billion |
Liability Composition Analysis (2004–2024)
This chart breaks down TongFu Microelectronics Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see TongFu Microelectronics Co Ltd (002156) total market value.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.91 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.89 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.63 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how TongFu Microelectronics Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for TongFu Microelectronics Co Ltd (2004–2024)
The table below shows the annual total liabilities of TongFu Microelectronics Co Ltd from 2004 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥23.63 Billion ≈ $3.46 Billion |
+17.07% |
| 2023-12-31 | CN¥20.18 Billion ≈ $2.95 Billion |
-4.19% |
| 2022-12-31 | CN¥21.07 Billion ≈ $3.08 Billion |
+31.03% |
| 2021-12-31 | CN¥16.08 Billion ≈ $2.35 Billion |
+43.36% |
| 2020-12-31 | CN¥11.22 Billion ≈ $1.64 Billion |
+16.17% |
| 2019-12-31 | CN¥9.65 Billion ≈ $1.41 Billion |
+29.32% |
| 2018-12-31 | CN¥7.47 Billion ≈ $1.09 Billion |
+26.79% |
| 2017-12-31 | CN¥5.89 Billion ≈ $861.62 Million |
+16.34% |
| 2016-12-31 | CN¥5.06 Billion ≈ $740.64 Million |
+82.62% |
| 2015-12-31 | CN¥2.77 Billion ≈ $405.57 Million |
+74.25% |
| 2014-12-31 | CN¥1.59 Billion ≈ $232.75 Million |
+11.22% |
| 2013-12-31 | CN¥1.43 Billion ≈ $209.26 Million |
+21.84% |
| 2012-12-31 | CN¥1.17 Billion ≈ $171.75 Million |
-2.97% |
| 2011-12-31 | CN¥1.21 Billion ≈ $177.01 Million |
-19.46% |
| 2010-12-31 | CN¥1.50 Billion ≈ $219.78 Million |
+45.81% |
| 2009-12-31 | CN¥1.03 Billion ≈ $150.73 Million |
+18.54% |
| 2008-12-31 | CN¥868.93 Million ≈ $127.15 Million |
-20.23% |
| 2007-12-31 | CN¥1.09 Billion ≈ $159.39 Million |
+0.63% |
| 2006-12-31 | CN¥1.08 Billion ≈ $158.40 Million |
+10.63% |
| 2005-12-31 | CN¥978.43 Million ≈ $143.18 Million |
+31.80% |
| 2004-12-31 | CN¥742.34 Million ≈ $108.63 Million |
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About TongFu Microelectronics Co Ltd
Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more