TongFu Microelectronics Co Ltd (002156) - Total Liabilities
Based on the latest financial reports, TongFu Microelectronics Co Ltd (002156) has total liabilities worth CN¥28.67 Billion CNY (≈ $4.19 Billion USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore TongFu Microelectronics Co Ltd (002156) long-term investment share to see how much of total assets are deployed in long-term investments.
TongFu Microelectronics Co Ltd - Total Liabilities Trend (2004–2024)
This chart illustrates how TongFu Microelectronics Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see total assets of TongFu Microelectronics Co Ltd.
TongFu Microelectronics Co Ltd Competitors by Total Liabilities
The table below lists competitors of TongFu Microelectronics Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Polycab India Limited
NSE:POLYCAB
|
India | Rs92.18 Billion |
|
China Gold International Resources
TO:CGG
|
Canada | CA$935.65 Million |
|
iA Financial Corporation Inc
TO:IAG
|
Canada | CA$126.21 Billion |
|
CVC Capital Partners PLC
AS:CVC
|
Netherlands | €3.06 Billion |
|
Healthpeak Properties Inc
NYSE:DOC
|
USA | $12.56 Billion |
|
EIFFAGE S.A.ADR 1/5/EO 4
F:EF30
|
Germany | €32.04 Billion |
|
China International Capital Corp Ltd
SHG:601995
|
China | CN¥665.02 Billion |
|
Bajaj Holdings & Investment Limited
NSE:BAJAJHLDNG
|
India | Rs27.69 Billion |
Liability Composition Analysis (2004–2024)
This chart breaks down TongFu Microelectronics Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See how leveraged is TongFu Microelectronics Co Ltd's balance sheet to measure how much of total assets are equity-financed.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.91 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.89 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.63 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how TongFu Microelectronics Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for TongFu Microelectronics Co Ltd (2004–2024)
The table below shows the annual total liabilities of TongFu Microelectronics Co Ltd from 2004 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥23.63 Billion ≈ $3.46 Billion |
+17.07% |
| 2023-12-31 | CN¥20.18 Billion ≈ $2.95 Billion |
-4.19% |
| 2022-12-31 | CN¥21.07 Billion ≈ $3.08 Billion |
+31.03% |
| 2021-12-31 | CN¥16.08 Billion ≈ $2.35 Billion |
+43.36% |
| 2020-12-31 | CN¥11.22 Billion ≈ $1.64 Billion |
+16.17% |
| 2019-12-31 | CN¥9.65 Billion ≈ $1.41 Billion |
+29.32% |
| 2018-12-31 | CN¥7.47 Billion ≈ $1.09 Billion |
+26.79% |
| 2017-12-31 | CN¥5.89 Billion ≈ $861.62 Million |
+16.34% |
| 2016-12-31 | CN¥5.06 Billion ≈ $740.64 Million |
+82.62% |
| 2015-12-31 | CN¥2.77 Billion ≈ $405.57 Million |
+74.25% |
| 2014-12-31 | CN¥1.59 Billion ≈ $232.75 Million |
+11.22% |
| 2013-12-31 | CN¥1.43 Billion ≈ $209.26 Million |
+21.84% |
| 2012-12-31 | CN¥1.17 Billion ≈ $171.75 Million |
-2.97% |
| 2011-12-31 | CN¥1.21 Billion ≈ $177.01 Million |
-19.46% |
| 2010-12-31 | CN¥1.50 Billion ≈ $219.78 Million |
+45.81% |
| 2009-12-31 | CN¥1.03 Billion ≈ $150.73 Million |
+18.54% |
| 2008-12-31 | CN¥868.93 Million ≈ $127.15 Million |
-20.23% |
| 2007-12-31 | CN¥1.09 Billion ≈ $159.39 Million |
+0.63% |
| 2006-12-31 | CN¥1.08 Billion ≈ $158.40 Million |
+10.63% |
| 2005-12-31 | CN¥978.43 Million ≈ $143.18 Million |
+31.80% |
| 2004-12-31 | CN¥742.34 Million ≈ $108.63 Million |
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About TongFu Microelectronics Co Ltd
Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more