Haesung DS Co Ltd (195870) - Total Liabilities

Latest as of September 2025: ₩327.52 Billion KRW ≈ $221.96 Million USD

Based on the latest financial reports, Haesung DS Co Ltd (195870) has total liabilities worth ₩327.52 Billion KRW (≈ $221.96 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore investment intensity of Haesung DS Co Ltd to see how much of total assets are deployed in long-term investments.

Haesung DS Co Ltd - Total Liabilities Trend (2014–2024)

This chart illustrates how Haesung DS Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see Haesung DS Co Ltd balance sheet assets.

Haesung DS Co Ltd Competitors by Total Liabilities

The table below lists competitors of Haesung DS Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Shinry Technologies Co Ltd Class A
SHE:300745
China CN¥2.48 Billion
Xuchang Yuandong Drive Shaft Co Ltd
SHE:002406
China CN¥1.29 Billion
Shenzhen Prince New Materials Co Ltd
SHE:002735
China CN¥1.49 Billion
WESTROCK COFFEE CL.A
F:V3J
Germany €904.34 Million
Coastal Financial Corp
NASDAQ:CCB
USA $5.16 Billion
Yangzhou Seashine New Materials Co
SHE:300885
China CN¥60.63 Million
SENORES PHARMACEUTICALS L
NSE:SENORES
India Rs6.39 Billion
Elec-Tech International Co Ltd
SHE:002005
China CN¥736.50 Million

Liability Composition Analysis (2014–2024)

This chart breaks down Haesung DS Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Haesung DS Co Ltd balance sheet independence to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.77 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.59 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.37 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Haesung DS Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Haesung DS Co Ltd (2014–2024)

The table below shows the annual total liabilities of Haesung DS Co Ltd from 2014 to 2024.

Year Total Liabilities Change
2024-12-31 ₩237.92 Billion
≈ $161.23 Million
+36.99%
2023-12-31 ₩173.68 Billion
≈ $117.70 Million
-18.20%
2022-12-31 ₩212.32 Billion
≈ $143.89 Million
+17.54%
2021-12-31 ₩180.63 Billion
≈ $122.41 Million
+19.33%
2020-12-31 ₩151.37 Billion
≈ $102.58 Million
+28.23%
2019-12-31 ₩118.05 Billion
≈ $80.00 Million
+7.44%
2018-12-31 ₩109.88 Billion
≈ $74.46 Million
+0.50%
2017-12-31 ₩109.33 Billion
≈ $74.09 Million
+22.02%
2016-12-31 ₩89.60 Billion
≈ $60.72 Million
-18.72%
2015-12-31 ₩110.24 Billion
≈ $74.70 Million
-2.29%
2014-12-31 ₩112.82 Billion
≈ $76.45 Million
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About Haesung DS Co Ltd

KO:195870 Korea Semiconductor Equipment & Materials
Market Cap
$687.78 Million
₩1.01 Trillion KRW
Market Cap Rank
#10823 Global
#288 in Korea
Share Price
₩59700.00
Change (1 day)
+6.04%
52-Week Range
₩28300.00 - ₩102400.00
All Time High
₩102400.00
About

HAESUNG DS Co., Ltd. manufactures and sells semiconductor components in South Korea and internationally. The company offers lead frames for use in automotive, mobile device, personal computer, industrial, power, and consumer electronics applications; package substrates for use in AI, personal computer, server, SSD, IOT, mobile, and graphic card applications; tape substances for use in payment car… Read more