Haesung DS Co Ltd (195870) - Total Liabilities
Based on the latest financial reports, Haesung DS Co Ltd (195870) has total liabilities worth ₩327.52 Billion KRW (≈ $221.96 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore Haesung DS Co Ltd (195870) equity growth momentum to track the company's year-over-year net asset growth rate.
Haesung DS Co Ltd - Total Liabilities Trend (2014–2024)
This chart illustrates how Haesung DS Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See 195870 free cash flow generation to measure how efficiently the company converts operating cash flow to free cash.
Haesung DS Co Ltd Competitors by Total Liabilities
The table below lists competitors of Haesung DS Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Wesure Global Tech Ltd
TA:WESR
|
Israel | ILA18.79 Billion |
|
Franklin BSP Realty Trust Inc
NYSE:FBRT
|
USA | $4.82 Billion |
|
Natural Grocers by Vitamin Cottage Inc
NYSE:NGVC
|
USA | $291.33 Million |
|
Basellandschaftliche Kantonalbank
SW:BLKB
|
Switzerland | CHF34.60 Billion |
|
Hainan Haiqi Transportation Group Co Ltd
SHG:603069
|
China | CN¥1.80 Billion |
|
Global PMX Co Ltd
TW:4551
|
Taiwan | NT$5.37 Billion |
|
Nantong Guosheng Intelligence Technology Group Co Ltd
SHG:688558
|
China | CN¥560.00 Million |
|
Ichitan Group Public Company Limited
BK:ICHI
|
Thailand | ฿1.34 Billion |
Liability Composition Analysis (2014–2024)
This chart breaks down Haesung DS Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Haesung DS Co Ltd (195870) market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.77 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.59 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.37 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Haesung DS Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Haesung DS Co Ltd (2014–2024)
The table below shows the annual total liabilities of Haesung DS Co Ltd from 2014 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | ₩237.92 Billion ≈ $161.23 Million |
+36.99% |
| 2023-12-31 | ₩173.68 Billion ≈ $117.70 Million |
-18.20% |
| 2022-12-31 | ₩212.32 Billion ≈ $143.89 Million |
+17.54% |
| 2021-12-31 | ₩180.63 Billion ≈ $122.41 Million |
+19.33% |
| 2020-12-31 | ₩151.37 Billion ≈ $102.58 Million |
+28.23% |
| 2019-12-31 | ₩118.05 Billion ≈ $80.00 Million |
+7.44% |
| 2018-12-31 | ₩109.88 Billion ≈ $74.46 Million |
+0.50% |
| 2017-12-31 | ₩109.33 Billion ≈ $74.09 Million |
+22.02% |
| 2016-12-31 | ₩89.60 Billion ≈ $60.72 Million |
-18.72% |
| 2015-12-31 | ₩110.24 Billion ≈ $74.70 Million |
-2.29% |
| 2014-12-31 | ₩112.82 Billion ≈ $76.45 Million |
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About Haesung DS Co Ltd
HAESUNG DS Co., Ltd. manufactures and sells semiconductor components in South Korea and internationally. The company offers lead frames for use in automotive, mobile device, personal computer, industrial, power, and consumer electronics applications; package substrates for use in AI, personal computer, server, SSD, IOT, mobile, and graphic card applications; tape substances for use in payment car… Read more