Telechips Inc (054450) - Total Liabilities

Latest as of September 2025: ₩189.04 Billion KRW ≈ $128.11 Million USD

Based on the latest financial reports, Telechips Inc (054450) has total liabilities worth ₩189.04 Billion KRW (≈ $128.11 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Telechips Inc - Total Liabilities Trend (2009–2024)

This chart illustrates how Telechips Inc's total liabilities have evolved over time, based on quarterly financial data. See 054450 working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Telechips Inc Competitors by Total Liabilities

The table below lists competitors of Telechips Inc ranked by their total liabilities.

Company Country Total Liabilities
PPX Mining Corp
V:PPX
Canada CA$66.12 Million
Action SA
WAR:ACT
Poland zł322.63 Million
Hecto Innovation Co. Ltd.
KQ:214180
Korea ₩396.13 Billion
Dala Energi AB
ST:DE
Sweden Skr125.74 Million
Polski Holding Nieruchomości SA
WAR:PHN
Poland zł2.37 Billion
Graphene Manufacturing Group Ltd
V:GMG
Canada CA$11.57 Million
Daewon Pharm
KO:003220
Korea ₩339.07 Billion
SKYX Platforms Corp
NASDAQ:SKYX
USA $54.12 Million

Liability Composition Analysis (2009–2024)

This chart breaks down Telechips Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of Telechips Inc.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.21 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.99 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.50 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Telechips Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Telechips Inc (2009–2024)

The table below shows the annual total liabilities of Telechips Inc from 2009 to 2024.

Year Total Liabilities Change
2024-12-31 ₩176.14 Billion
≈ $119.37 Million
+36.97%
2023-12-31 ₩128.59 Billion
≈ $87.15 Million
-8.48%
2022-12-31 ₩140.50 Billion
≈ $95.22 Million
+39.14%
2021-12-31 ₩100.98 Billion
≈ $68.43 Million
+37.23%
2020-12-31 ₩73.59 Billion
≈ $49.87 Million
+39.46%
2019-12-31 ₩52.77 Billion
≈ $35.76 Million
+28.89%
2018-12-31 ₩40.94 Billion
≈ $27.74 Million
-0.65%
2017-12-31 ₩41.21 Billion
≈ $27.92 Million
+22.40%
2016-12-31 ₩33.66 Billion
≈ $22.81 Million
+14.57%
2015-12-31 ₩29.38 Billion
≈ $19.91 Million
+66.27%
2010-12-31 ₩17.67 Billion
≈ $11.98 Million
+7.47%
2009-12-31 ₩16.44 Billion
≈ $11.14 Million
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About Telechips Inc

KQ:054450 Korea Semiconductors
Market Cap
$131.95 Million
₩194.70 Billion KRW
Market Cap Rank
#18238 Global
#826 in Korea
Share Price
₩13190.00
Change (1 day)
-1.93%
52-Week Range
₩11000.00 - ₩18450.00
All Time High
₩35150.00
About

Telechips Inc. operates as a fabless semiconductor company. The company provides a solution of chipset, development environment, hardware design reference, and core technology, as well as security solution and low power technology. It offers intelligent automotive solution for driving and entertainment, including evolutionary smart cockpit, premium display audio, IVI and cluster, car AVN, and aud… Read more