Duksan Hi Metal Co.Ltd (077360) - Total Liabilities
Based on the latest financial reports, Duksan Hi Metal Co.Ltd (077360) has total liabilities worth ₩320.20 Billion KRW (≈ $216.99 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Duksan Hi Metal Co.Ltd long-term investment intensity to see how much of total assets are deployed in long-term investments.
Duksan Hi Metal Co.Ltd - Total Liabilities Trend (2013–2025)
This chart illustrates how Duksan Hi Metal Co.Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see Duksan Hi Metal Co.Ltd balance sheet assets.
Duksan Hi Metal Co.Ltd Competitors by Total Liabilities
The table below lists competitors of Duksan Hi Metal Co.Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Assertio Therapeutics Inc
NASDAQ:ASRT
|
USA | $135.67 Million |
|
Hanmiglobal
KO:053690
|
Korea | ₩209.78 Billion |
|
Texaf SA
BR:TEXF
|
Belgium | €62.77 Million |
|
Rav Bariach 08 Industries Ltd
TA:BRIH
|
Israel | ILA955.82 Million |
|
OrganiGram Holdings Inc
TO:OGI
|
Canada | CA$149.50 Million |
|
ADTechnology Co.Ltd
KQ:200710
|
Korea | ₩157.56 Billion |
|
AMIA Co. Ltd.
TW:8438
|
Taiwan | NT$1.15 Billion |
|
Powerwell Holdings Bhd
KLSE:0217
|
Malaysia | RM68.20 Million |
Liability Composition Analysis (2013–2025)
This chart breaks down Duksan Hi Metal Co.Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See 077360 net asset quality index to measure how much of total assets are equity-financed.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.92 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.55 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.49 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Duksan Hi Metal Co.Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Duksan Hi Metal Co.Ltd (2013–2025)
The table below shows the annual total liabilities of Duksan Hi Metal Co.Ltd from 2013 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | ₩320.20 Billion ≈ $216.99 Million |
-11.94% |
| 2024-12-31 | ₩363.64 Billion ≈ $246.43 Million |
+13.36% |
| 2023-12-31 | ₩320.78 Billion ≈ $217.38 Million |
+364.04% |
| 2022-12-31 | ₩69.13 Billion ≈ $46.85 Million |
+11.91% |
| 2021-12-31 | ₩61.77 Billion ≈ $41.86 Million |
+382.63% |
| 2020-12-31 | ₩12.80 Billion ≈ $8.67 Million |
+62.45% |
| 2019-12-31 | ₩7.88 Billion ≈ $5.34 Million |
+236.23% |
| 2018-12-31 | ₩2.34 Billion ≈ $1.59 Million |
+31.53% |
| 2017-12-31 | ₩1.78 Billion ≈ $1.21 Million |
-85.24% |
| 2016-12-31 | ₩12.07 Billion ≈ $8.18 Million |
-66.34% |
| 2015-12-31 | ₩35.86 Billion ≈ $24.30 Million |
-30.61% |
| 2014-12-31 | ₩51.68 Billion ≈ $35.02 Million |
+140.24% |
| 2013-12-31 | ₩21.51 Billion ≈ $14.58 Million |
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About Duksan Hi Metal Co.Ltd
Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more