Duksan Hi Metal Co.Ltd (077360) - Total Liabilities

Latest as of December 2025: ₩320.20 Billion KRW ≈ $216.99 Million USD

Based on the latest financial reports, Duksan Hi Metal Co.Ltd (077360) has total liabilities worth ₩320.20 Billion KRW (≈ $216.99 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Duksan Hi Metal Co.Ltd - Total Liabilities Trend (2013–2025)

This chart illustrates how Duksan Hi Metal Co.Ltd's total liabilities have evolved over time, based on quarterly financial data. See Duksan Hi Metal Co.Ltd (077360) working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Duksan Hi Metal Co.Ltd Competitors by Total Liabilities

The table below lists competitors of Duksan Hi Metal Co.Ltd ranked by their total liabilities.

Company Country Total Liabilities
Urbana Corporation
TO:URB-A
Canada CA$86.26 Million
Taita Chemical Co Ltd
TW:1309
Taiwan NT$2.82 Billion
Globa Terra Acquisition Corporation Class A Ordinary Shares
NASDAQ:GTERA
USA $1.21 Million
XRF Scientific Ltd
AU:XRF
Australia AU$8.67 Million
Kumpulan Fima Bhd
KLSE:6491
Malaysia RM599.89 Million
BF Investment Limited
NSE:BFINVEST
India Rs8.55 Billion
Chunil Express
KO:000650
Korea ₩42.56 Billion
Ador Welding Limited
NSE:ADORWELD
India Rs1.87 Billion

Liability Composition Analysis (2013–2025)

This chart breaks down Duksan Hi Metal Co.Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market cap of Duksan Hi Metal Co.Ltd.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.92 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.55 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.49 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Duksan Hi Metal Co.Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Duksan Hi Metal Co.Ltd (2013–2025)

The table below shows the annual total liabilities of Duksan Hi Metal Co.Ltd from 2013 to 2025.

Year Total Liabilities Change
2025-12-31 ₩320.20 Billion
≈ $216.99 Million
-11.94%
2024-12-31 ₩363.64 Billion
≈ $246.43 Million
+13.36%
2023-12-31 ₩320.78 Billion
≈ $217.38 Million
+364.04%
2022-12-31 ₩69.13 Billion
≈ $46.85 Million
+11.91%
2021-12-31 ₩61.77 Billion
≈ $41.86 Million
+382.63%
2020-12-31 ₩12.80 Billion
≈ $8.67 Million
+62.45%
2019-12-31 ₩7.88 Billion
≈ $5.34 Million
+236.23%
2018-12-31 ₩2.34 Billion
≈ $1.59 Million
+31.53%
2017-12-31 ₩1.78 Billion
≈ $1.21 Million
-85.24%
2016-12-31 ₩12.07 Billion
≈ $8.18 Million
-66.34%
2015-12-31 ₩35.86 Billion
≈ $24.30 Million
-30.61%
2014-12-31 ₩51.68 Billion
≈ $35.02 Million
+140.24%
2013-12-31 ₩21.51 Billion
≈ $14.58 Million
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About Duksan Hi Metal Co.Ltd

KQ:077360 Korea Semiconductors & Semiconductor Equipment
Market Cap
$184.62 Million
₩272.43 Billion KRW
Market Cap Rank
#16944 Global
#656 in Korea
Share Price
₩13650.00
Change (1 day)
-4.68%
52-Week Range
₩4060.00 - ₩19590.00
All Time High
₩19590.00
About

Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more