Duksan Hi Metal Co.Ltd (077360) - Total Liabilities

Latest as of September 2025: ₩353.87 Billion KRW ≈ $239.81 Million USD

Based on the latest financial reports, Duksan Hi Metal Co.Ltd (077360) has total liabilities worth ₩353.87 Billion KRW (≈ $239.81 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore cash efficiency ratio of Duksan Hi Metal Co.Ltd to assess how effectively this company generates cash.

Duksan Hi Metal Co.Ltd - Total Liabilities Trend (2013–2024)

This chart illustrates how Duksan Hi Metal Co.Ltd's total liabilities have evolved over time, based on quarterly financial data. Check 077360 asset resilience ratio to evaluate the company's liquid asset resilience ratio.

Duksan Hi Metal Co.Ltd Competitors by Total Liabilities

The table below lists competitors of Duksan Hi Metal Co.Ltd ranked by their total liabilities.

Company Country Total Liabilities
Compagnie Du Mont-Blanc
PA:MLCMB
France €60.29 Million
Lionheart Holdings
NASDAQ:CUB
USA $253.86 Million
BTB Real Estate Investment Trust
TO:BTB-UN
Canada CA$752.95 Million
Mastersystem Infotama Tbk.
JK:MSTI
Indonesia Rp873.42 Billion
Hisem Co Ltd
KQ:200470
Korea ₩107.16 Billion
Beacon Lighting Group Ltd
AU:BLX
Australia AU$212.17 Million
AG Mortgage Investment Trust Inc
NYSE:MITT
USA $8.42 Billion
Xplora Technologies As
OL:XPLRA
Norway Nkr1.64 Billion

Liability Composition Analysis (2013–2024)

This chart breaks down Duksan Hi Metal Co.Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market cap of Duksan Hi Metal Co.Ltd.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.76 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.13 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.44 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Duksan Hi Metal Co.Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Duksan Hi Metal Co.Ltd (2013–2024)

The table below shows the annual total liabilities of Duksan Hi Metal Co.Ltd from 2013 to 2024.

Year Total Liabilities Change
2024-12-31 ₩363.64 Billion
≈ $246.43 Million
+13.36%
2023-12-31 ₩320.78 Billion
≈ $217.38 Million
+364.04%
2022-12-31 ₩69.13 Billion
≈ $46.85 Million
+11.91%
2021-12-31 ₩61.77 Billion
≈ $41.86 Million
+382.63%
2020-12-31 ₩12.80 Billion
≈ $8.67 Million
+62.45%
2019-12-31 ₩7.88 Billion
≈ $5.34 Million
+236.23%
2018-12-31 ₩2.34 Billion
≈ $1.59 Million
+31.53%
2017-12-31 ₩1.78 Billion
≈ $1.21 Million
-85.24%
2016-12-31 ₩12.07 Billion
≈ $8.18 Million
-66.34%
2015-12-31 ₩35.86 Billion
≈ $24.30 Million
-30.61%
2014-12-31 ₩51.68 Billion
≈ $35.02 Million
+140.24%
2013-12-31 ₩21.51 Billion
≈ $14.58 Million
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About Duksan Hi Metal Co.Ltd

KQ:077360 Korea Semiconductors & Semiconductor Equipment
Market Cap
$248.33 Million
₩366.43 Billion KRW
Market Cap Rank
#15713 Global
#610 in Korea
Share Price
₩18360.00
Change (1 day)
+4.14%
52-Week Range
₩3820.00 - ₩18360.00
All Time High
₩18360.00
About

Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more