Duksan Hi Metal Co.Ltd (077360) - Net Assets

Latest as of December 2025: ₩338.76 Billion KRW ≈ $229.58 Million USD

Based on the latest financial reports, Duksan Hi Metal Co.Ltd (077360) has net assets worth ₩338.76 Billion KRW (≈ $229.58 Million USD) as of December 2025. Net assets (also known as shareholders' equity or book value) represent the difference between a company's total assets (₩658.96 Billion ≈ $446.57 Million USD) and total liabilities (₩320.20 Billion ≈ $216.99 Million USD). This figure indicates the residual interest in the assets after deducting liabilities, essentially showing what would remain for shareholders if all assets were liquidated and all debts paid off. Check Duksan Hi Metal Co.Ltd (077360) tangible equity ratio to evaluate the tangible quality of the company's equity base.

Key Net Assets Metrics

Metric Value
Current Net Assets ₩338.76 Billion
% of Total Assets 51.41%
Annual Growth Rate 3.47%
5-Year Change 29.35%
10-Year Change 97.62%
Growth Volatility 19.81

Duksan Hi Metal Co.Ltd - Net Assets Trend (2013–2025)

This chart illustrates how Duksan Hi Metal Co.Ltd's net assets have evolved over time, based on quarterly financial data. See Duksan Hi Metal Co.Ltd (077360) liquidity interval to measure how many days the company can operate on defensive assets alone.

Annual Net Assets for Duksan Hi Metal Co.Ltd (2013–2025)

The table below shows the annual net assets of Duksan Hi Metal Co.Ltd from 2013 to 2025. For live valuation and market cap data, see 077360 stock market capitalisation.

Year Net Assets Change
2025-12-31 ₩338.76 Billion
≈ $229.58 Million
-25.52%
2024-12-31 ₩454.85 Billion
≈ $308.25 Million
+7.95%
2023-12-31 ₩421.36 Billion
≈ $285.55 Million
+43.12%
2022-12-31 ₩294.41 Billion
≈ $199.52 Million
+12.41%
2021-12-31 ₩261.90 Billion
≈ $177.49 Million
+20.55%
2020-12-31 ₩217.25 Billion
≈ $147.23 Million
+7.40%
2019-12-31 ₩202.29 Billion
≈ $137.09 Million
+4.32%
2018-12-31 ₩193.91 Billion
≈ $131.41 Million
+7.58%
2017-12-31 ₩180.25 Billion
≈ $122.15 Million
+5.15%
2016-12-31 ₩171.42 Billion
≈ $116.17 Million
-6.16%
2015-12-31 ₩182.68 Billion
≈ $123.80 Million
+23.50%
2014-12-31 ₩147.92 Billion
≈ $100.24 Million
-34.26%
2013-12-31 ₩225.01 Billion
≈ $152.49 Million
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Equity Component Analysis

This analysis shows how different components contribute to Duksan Hi Metal Co.Ltd's total equity over time. Equity components include common stock, retained earnings, additional paid-in capital, and other elements.

Equity Composition Insights

  • Retained earnings have grown by 2145.9% over the analyzed period, indicating profitable operations and earnings retention.

Current Equity Component Breakdown (December 2025)

Component Amount Percentage
Retained Earnings ₩168.83 Billion 81.77%
Other Components ₩37.65 Billion 18.23%
Total Equity ₩206.47 Billion 100.00%

Duksan Hi Metal Co.Ltd Competitors by Market Cap

The table below lists competitors of Duksan Hi Metal Co.Ltd ranked by their market capitalization.

Company Market Cap
XRF Scientific Ltd
AU:XRF
$184.65 Million
Globa Terra Acquisition Corporation Class A Ordinary Shares
NASDAQ:GTERA
$184.66 Million
Taita Chemical Co Ltd
TW:1309
$184.76 Million
Urbana Corporation
TO:URB-A
$184.87 Million
Kumpulan Fima Bhd
KLSE:6491
$184.62 Million
BF Investment Limited
NSE:BFINVEST
$184.53 Million
Chunil Express
KO:000650
$184.52 Million
Ador Welding Limited
NSE:ADORWELD
$184.52 Million

Equity Growth Attribution

This analysis shows how different factors contributed to changes in Duksan Hi Metal Co.Ltd's equity between the two most recent reporting periods.

Equity Growth Insights

  • From 2024 to 2025, total equity changed from 313,377,936,660 to 206,474,694,120, a change of -106,903,242,540 (-34.1%).
  • Net loss of 106,024,997,630 reduced equity.
  • Dividend payments of 1,540,000,000 reduced retained earnings.
  • New share issuances of 613,800,000 increased equity.

Equity Change Factors (2024 to 2025)

Factor Impact Contribution
Net Income ₩-106.02 Billion -51.35%
Dividends Paid ₩1.54 Billion -0.75%
Share Issuances ₩613.80 Million +0.3%
Other Changes ₩47.96 Million +0.02%
Total Change ₩- -34.11%

Book Value vs Market Value Analysis

This analysis compares Duksan Hi Metal Co.Ltd's book value (net assets) with its market value over time. The relationship between these values can provide insights into investor sentiment and company valuation.

Valuation Insights

  • Current price-to-book ratio: 3.00x
  • The company is trading at a significant premium to its book value, suggesting the market values its earnings potential, brand, or other intangibles highly.
  • The price-to-book ratio has decreased from 3.18x to 3.00x over the analyzed period, indicating reduced market premium.

Historical Price-to-Book Ratios

Date Book Value per Share Market Price P/B Ratio
2016-12-31 ₩4294.55 ₩13650.00 x
2017-12-31 ₩4515.61 ₩13650.00 x
2018-12-31 ₩4857.82 ₩13650.00 x
2019-12-31 ₩5067.83 ₩13650.00 x
2020-12-31 ₩5442.60 ₩13650.00 x
2021-12-31 ₩6136.86 ₩13650.00 x
2022-12-31 ₩6479.56 ₩13650.00 x
2023-12-31 ₩6369.09 ₩13650.00 x
2024-12-31 ₩6896.98 ₩13650.00 x
2025-12-31 ₩4544.20 ₩13650.00 x

Capital Efficiency Dashboard

This dashboard shows how efficiently Duksan Hi Metal Co.Ltd utilizes its equity to generate returns, including Return on Equity (ROE) and its components based on the DuPont analysis framework.

Capital Efficiency Insights

  • Current Return on Equity (ROE): -51.35%
  • The company may be facing challenges in efficiently utilizing shareholder equity.
  • DuPont Analysis Breakdown:
  • • Net Profit Margin: -44.85%
  • • Asset Turnover: 0.36x
  • • Equity Multiplier: 3.19x
  • Recent ROE (-51.35%) is below the historical average (2.12%), suggesting potential challenges in capital efficiency.

Historical Capital Efficiency Metrics

Year Return on Equity Net Profit Margin Asset Turnover Equity Multiplier Economic Value Added
2013 14.23% 24.66% 0.50x 1.14x ₩9.12 Billion
2014 29.84% 71.09% 0.29x 1.44x ₩27.51 Billion
2015 -6.86% -23.65% 0.24x 1.23x ₩-29.89 Billion
2016 -4.34% -17.37% 0.23x 1.07x ₩-24.58 Billion
2017 4.50% 18.01% 0.25x 1.01x ₩-9.91 Billion
2018 6.27% 25.44% 0.24x 1.01x ₩-7.24 Billion
2019 5.56% 21.71% 0.25x 1.04x ₩-8.99 Billion
2020 7.03% 27.64% 0.24x 1.06x ₩-6.46 Billion
2021 12.17% 34.36% 0.29x 1.24x ₩5.67 Billion
2022 2.07% 3.70% 0.45x 1.23x ₩-23.35 Billion
2023 1.96% 3.92% 0.19x 2.56x ₩-23.28 Billion
2024 6.51% 8.64% 0.29x 2.61x ₩-10.95 Billion
2025 -51.35% -44.85% 0.36x 3.19x ₩-126.67 Billion

Industry Comparison

This section compares Duksan Hi Metal Co.Ltd's net assets metrics with peer companies in the Semiconductors & Semiconductor Equipment industry.

Industry Context

  • Industry: Semiconductors & Semiconductor Equipment
  • Average net assets among peers: $92,481,208,211
  • Average return on equity (ROE) among peers: -2.64%

Peer Company Comparison

Company Net Assets Return on Equity Debt-to-Equity Market Cap
Duksan Hi Metal Co.Ltd (077360) ₩338.76 Billion 14.23% 0.95x $184.62 Million
PSK HOLDINGS Inc (031980) $114.04 Billion 7.36% 0.10x $445.83 Million
Fidelix Co. Ltd (032580) $49.07 Billion 16.81% 0.18x $96.78 Million
Cloud Air Co.Ltd (036170) $105.14 Billion 1.44% 0.03x $82.54 Million
UNISEM Co. Ltd (036200) $52.10 Billion 3.39% 0.86x $219.23 Million
JUSUNG ENGINEERING Co. Ltd (036930) $227.40 Billion -3.61% 1.42x $6.95 Billion
Lumens Co. Ltd (038060) $95.10 Billion -18.33% 1.51x $27.65 Million
iA Inc (038880) $58.90 Billion -58.32% 0.80x $102.39 Million
meerecompany Incorporated (049950) $103.36 Billion 19.11% 0.37x $55.52 Million
I&C Technology Co. Ltd (052860) $43.35 Billion 3.65% 0.46x $56.95 Million
KMH Hitech Co. Ltd (052900) $76.34 Billion 2.05% 0.31x $44.57 Million

About Duksan Hi Metal Co.Ltd

KQ:077360 Korea Semiconductors & Semiconductor Equipment
Market Cap
$184.62 Million
₩272.43 Billion KRW
Market Cap Rank
#16944 Global
#656 in Korea
Share Price
₩13650.00
Change (1 day)
-4.68%
52-Week Range
₩4060.00 - ₩19590.00
All Time High
₩19590.00
About

Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more