Duksan Hi Metal Co.Ltd - Asset Resilience Ratio
Duksan Hi Metal Co.Ltd (077360) has an Asset Resilience Ratio of 0.99% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2013–2025)
This chart shows how Duksan Hi Metal Co.Ltd's Asset Resilience Ratio has changed over time. Check 077360 strategic asset allocation to assess the company's strategic physical and investment asset allocation.
Liquid Assets Composition Over Time
This chart breaks down Duksan Hi Metal Co.Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 077360 company net worth.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | ₩0.00 | 0% |
| Short-term Investments | ₩6.54 Billion | 0.99% |
| Total Liquid Assets | ₩6.54 Billion | 0.99% |
Asset Resilience Insights
- Limited Liquidity: Duksan Hi Metal Co.Ltd maintains only 0.99% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Duksan Hi Metal Co.Ltd Industry Peers by Asset Resilience Ratio
Compare Duksan Hi Metal Co.Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
TES Co. Ltd
KQ:095610 |
Semiconductors & Semiconductor Equipment | 15.93% |
|
Eugene Technology Co.Ltd
KQ:084370 |
Semiconductors & Semiconductor Equipment | 36.24% |
|
UniTest Incorporation
KQ:086390 |
Semiconductors & Semiconductor Equipment | 6.56% |
|
Chips&Media Inc
KQ:094360 |
Semiconductors & Semiconductor Equipment | 39.53% |
|
ISC Co. Ltd
KQ:095340 |
Semiconductors & Semiconductor Equipment | 42.45% |
|
JUSUNG ENGINEERING Co. Ltd
KQ:036930 |
Semiconductors & Semiconductor Equipment | 27.33% |
|
Tokai Carbon Korea Co. Ltd
KQ:064760 |
Semiconductors & Semiconductor Equipment | 39.88% |
|
TSE Co. Ltd
KQ:131290 |
Semiconductors & Semiconductor Equipment | 0.13% |
Annual Asset Resilience Ratio for Duksan Hi Metal Co.Ltd (2013–2025)
The table below shows the annual Asset Resilience Ratio data for Duksan Hi Metal Co.Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 0.99% | ₩6.54 Billion ≈ $4.43 Million |
₩658.96 Billion ≈ $446.57 Million |
-11.96pp |
| 2024-12-31 | 12.95% | ₩105.99 Billion ≈ $71.83 Million |
₩818.49 Billion ≈ $554.68 Million |
+3.39pp |
| 2023-12-31 | 9.56% | ₩70.96 Billion ≈ $48.09 Million |
₩742.14 Billion ≈ $502.93 Million |
+0.22pp |
| 2022-12-31 | 9.34% | ₩33.95 Billion ≈ $23.01 Million |
₩363.54 Billion ≈ $246.36 Million |
+3.62pp |
| 2021-12-31 | 5.72% | ₩18.51 Billion ≈ $12.54 Million |
₩323.67 Billion ≈ $219.35 Million |
-7.70pp |
| 2020-12-31 | 13.42% | ₩30.87 Billion ≈ $20.92 Million |
₩230.05 Billion ≈ $155.90 Million |
-5.20pp |
| 2019-12-31 | 18.62% | ₩39.13 Billion ≈ $26.52 Million |
₩210.17 Billion ≈ $142.43 Million |
-2.09pp |
| 2018-12-31 | 20.71% | ₩40.65 Billion ≈ $27.54 Million |
₩196.25 Billion ≈ $133.00 Million |
+4.54pp |
| 2017-12-31 | 16.17% | ₩29.44 Billion ≈ $19.95 Million |
₩182.03 Billion ≈ $123.36 Million |
+3.44pp |
| 2016-12-31 | 12.73% | ₩23.36 Billion ≈ $15.83 Million |
₩183.49 Billion ≈ $124.35 Million |
+11.19pp |
| 2015-12-31 | 1.54% | ₩3.37 Billion ≈ $2.28 Million |
₩218.54 Billion ≈ $148.10 Million |
-1.23pp |
| 2014-12-31 | 2.77% | ₩5.52 Billion ≈ $3.74 Million |
₩199.60 Billion ≈ $135.26 Million |
-20.64pp |
| 2013-12-31 | 23.41% | ₩57.71 Billion ≈ $39.11 Million |
₩246.52 Billion ≈ $167.06 Million |
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About Duksan Hi Metal Co.Ltd
Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more