Duksan Hi Metal Co.Ltd Cash Flow Conversion Efficiency
Duksan Hi Metal Co.Ltd cash flow conversion efficiency. Based on the latest financial reports, Duksan Hi Metal Co.Ltd (077360) has a cash flow conversion efficiency ratio of -0.001x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩-193.78 Million ≈ $-131.32K USD) by net assets (₩338.76 Billion ≈ $229.58 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.
Cash Flow Conversion Efficiency of Duksan Hi Metal Co.Ltd (2013–2025)
Cash flow conversion efficiency of Duksan Hi Metal Co.Ltd from 2013 to 2025. This chart illustrates how Duksan Hi Metal Co.Ltd's cash flow conversion efficiency has evolved over time, based on yearly financial data. View latest Duksan Hi Metal Co.Ltd stock price today for real-time trading data and today's change.
Duksan Hi Metal Co.Ltd Cash Flow Conversion Ratio Explained
Duksan Hi Metal Co.Ltd cash flow conversion ratio divides operating cash flow by net assets, so a higher ratio means more cash generated from each unit of shareholder equity.
Duksan Hi Metal Co.Ltd Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of Duksan Hi Metal Co.Ltd ranked by their cash flow conversion efficiency. Also see Duksan Hi Metal Co.Ltd market cap and net worth for the company's overall valuation and market capitalisation.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Santech Holdings Limited
NASDAQ:STEC
|
N/A |
|
China Automotive Systems Inc
NASDAQ:CAAS
|
0.048x |
|
ClearThink 1 Acquisition Corp.
NASDAQ:CTAA
|
-0.096x |
|
Samindo Resources Tbk
JK:MYOH
|
0.064x |
|
Concorde International Group Ltd.
NASDAQ:YOOV
|
N/A |
|
TRX Gold Corporation
TO:TNX
|
0.084x |
|
Cash Converters International
AU:CCV
|
0.024x |
|
KULR Technology Group Inc
NYSE MKT:KULR
|
-0.063x |
Annual Cash Flow Conversion Efficiency for Duksan Hi Metal Co.Ltd (2013–2025)
The table below shows the annual cash flow conversion efficiency of Duksan Hi Metal Co.Ltd from 2013 to 2025. Review cash generation quality of Duksan Hi Metal Co.Ltd to assess how much free cash flow the company generates relative to operating cash flow.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2025-12-31 | ₩338.76 Billion ≈ $229.58 Million |
₩4.84 Billion ≈ $3.28 Million |
0.014x | -52.87% |
| 2024-12-31 | ₩454.85 Billion ≈ $308.25 Million |
₩13.78 Billion ≈ $9.34 Million |
0.030x | +138.94% |
| 2023-12-31 | ₩421.36 Billion ≈ $285.55 Million |
₩5.34 Billion ≈ $3.62 Million |
0.013x | -0.67% |
| 2022-12-31 | ₩294.41 Billion ≈ $199.52 Million |
₩3.76 Billion ≈ $2.55 Million |
0.013x | +124.49% |
| 2021-12-31 | ₩261.90 Billion ≈ $177.49 Million |
₩-13.65 Billion ≈ $-9.25 Million |
-0.052x | -244.62% |
| 2020-12-31 | ₩217.25 Billion ≈ $147.23 Million |
₩7.83 Billion ≈ $5.31 Million |
0.036x | +0.41% |
| 2019-12-31 | ₩202.29 Billion ≈ $137.09 Million |
₩7.26 Billion ≈ $4.92 Million |
0.036x | -15.12% |
| 2018-12-31 | ₩193.91 Billion ≈ $131.41 Million |
₩8.20 Billion ≈ $5.56 Million |
0.042x | +465.52% |
| 2017-12-31 | ₩180.25 Billion ≈ $122.15 Million |
₩1.35 Billion ≈ $913.52K |
0.007x | -84.29% |
| 2016-12-31 | ₩171.42 Billion ≈ $116.17 Million |
₩8.16 Billion ≈ $5.53 Million |
0.048x | -26.54% |
| 2015-12-31 | ₩182.68 Billion ≈ $123.80 Million |
₩11.84 Billion ≈ $8.02 Million |
0.065x | -45.91% |
| 2014-12-31 | ₩147.92 Billion ≈ $100.24 Million |
₩17.72 Billion ≈ $12.01 Million |
0.120x | -33.77% |
| 2013-12-31 | ₩225.01 Billion ≈ $152.49 Million |
₩40.69 Billion ≈ $27.58 Million |
0.181x | -- |
About Duksan Hi Metal Co.Ltd
Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more