Duksan Hi Metal Co.Ltd Cash Flow Conversion Efficiency

Latest as of December 2025: -0.001x

Duksan Hi Metal Co.Ltd cash flow conversion efficiency. Based on the latest financial reports, Duksan Hi Metal Co.Ltd (077360) has a cash flow conversion efficiency ratio of -0.001x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩-193.78 Million ≈ $-131.32K USD) by net assets (₩338.76 Billion ≈ $229.58 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.

Cash Flow Conversion Efficiency of Duksan Hi Metal Co.Ltd (2013–2025)

Cash flow conversion efficiency of Duksan Hi Metal Co.Ltd from 2013 to 2025. This chart illustrates how Duksan Hi Metal Co.Ltd's cash flow conversion efficiency has evolved over time, based on yearly financial data. View latest Duksan Hi Metal Co.Ltd stock price today for real-time trading data and today's change.

Duksan Hi Metal Co.Ltd Cash Flow Conversion Ratio Explained

Duksan Hi Metal Co.Ltd cash flow conversion ratio divides operating cash flow by net assets, so a higher ratio means more cash generated from each unit of shareholder equity.

Duksan Hi Metal Co.Ltd Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Duksan Hi Metal Co.Ltd ranked by their cash flow conversion efficiency. Also see Duksan Hi Metal Co.Ltd market cap and net worth for the company's overall valuation and market capitalisation.

Company Cash Flow Conversion Efficiency
Santech Holdings Limited
NASDAQ:STEC
N/A
China Automotive Systems Inc
NASDAQ:CAAS
0.048x
ClearThink 1 Acquisition Corp.
NASDAQ:CTAA
-0.096x
Samindo Resources Tbk
JK:MYOH
0.064x
Concorde International Group Ltd.
NASDAQ:YOOV
N/A
TRX Gold Corporation
TO:TNX
0.084x
Cash Converters International
AU:CCV
0.024x
KULR Technology Group Inc
NYSE MKT:KULR
-0.063x

Annual Cash Flow Conversion Efficiency for Duksan Hi Metal Co.Ltd (2013–2025)

The table below shows the annual cash flow conversion efficiency of Duksan Hi Metal Co.Ltd from 2013 to 2025. Review cash generation quality of Duksan Hi Metal Co.Ltd to assess how much free cash flow the company generates relative to operating cash flow.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2025-12-31 ₩338.76 Billion
≈ $229.58 Million
₩4.84 Billion
≈ $3.28 Million
0.014x -52.87%
2024-12-31 ₩454.85 Billion
≈ $308.25 Million
₩13.78 Billion
≈ $9.34 Million
0.030x +138.94%
2023-12-31 ₩421.36 Billion
≈ $285.55 Million
₩5.34 Billion
≈ $3.62 Million
0.013x -0.67%
2022-12-31 ₩294.41 Billion
≈ $199.52 Million
₩3.76 Billion
≈ $2.55 Million
0.013x +124.49%
2021-12-31 ₩261.90 Billion
≈ $177.49 Million
₩-13.65 Billion
≈ $-9.25 Million
-0.052x -244.62%
2020-12-31 ₩217.25 Billion
≈ $147.23 Million
₩7.83 Billion
≈ $5.31 Million
0.036x +0.41%
2019-12-31 ₩202.29 Billion
≈ $137.09 Million
₩7.26 Billion
≈ $4.92 Million
0.036x -15.12%
2018-12-31 ₩193.91 Billion
≈ $131.41 Million
₩8.20 Billion
≈ $5.56 Million
0.042x +465.52%
2017-12-31 ₩180.25 Billion
≈ $122.15 Million
₩1.35 Billion
≈ $913.52K
0.007x -84.29%
2016-12-31 ₩171.42 Billion
≈ $116.17 Million
₩8.16 Billion
≈ $5.53 Million
0.048x -26.54%
2015-12-31 ₩182.68 Billion
≈ $123.80 Million
₩11.84 Billion
≈ $8.02 Million
0.065x -45.91%
2014-12-31 ₩147.92 Billion
≈ $100.24 Million
₩17.72 Billion
≈ $12.01 Million
0.120x -33.77%
2013-12-31 ₩225.01 Billion
≈ $152.49 Million
₩40.69 Billion
≈ $27.58 Million
0.181x --

About Duksan Hi Metal Co.Ltd

KQ:077360 Korea Semiconductors & Semiconductor Equipment
Market Cap
$128.49 Million
₩189.60 Billion KRW
Market Cap Rank
#18082 Global
#788 in Korea
Share Price
₩9500.00
Change (1 day)
+1.93%
52-Week Range
₩5200.00 - ₩19590.00
All Time High
₩19590.00
About

Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic componen… Read more