Dongwoon Anatech Co Ltd (094170) - Total Liabilities
Based on the latest financial reports, Dongwoon Anatech Co Ltd (094170) has total liabilities worth ₩46.84 Billion KRW (≈ $31.75 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Dongwoon Anatech Co Ltd strategic investment ratio to see how much of total assets are deployed in long-term investments.
Dongwoon Anatech Co Ltd - Total Liabilities Trend (2014–2025)
This chart illustrates how Dongwoon Anatech Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 094170 asset base.
Dongwoon Anatech Co Ltd Competitors by Total Liabilities
The table below lists competitors of Dongwoon Anatech Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Cigniti Technologies Limited
NSE:CIGNITITEC
|
India | Rs3.50 Billion |
|
Gospell Digital Technology Co Ltd
SHE:002848
|
China | CN¥390.53 Million |
|
Pekat Group Bhd
KLSE:0233
|
Malaysia | RM270.27 Million |
|
Robo.ai Inc.
NASDAQ:AIIO
|
USA | $104.16 Million |
|
Fine Semitech Corp
KQ:036810
|
Korea | ₩287.68 Billion |
|
Zhejiang XinNong Chemical Co Ltd Class A
SHE:002942
|
China | CN¥451.97 Million |
|
Divgi Torqtransfer Systems Limited
NSE:DIVGIITTS
|
India | Rs809.29 Million |
|
Atria Oyj A
HE:ATRAV
|
Finland | €562.70 Million |
Liability Composition Analysis (2014–2025)
This chart breaks down Dongwoon Anatech Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Dongwoon Anatech Co Ltd (094170) balance sheet quality index to measure how much of total assets are equity-financed.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 4.31 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.70 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.41 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Dongwoon Anatech Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Dongwoon Anatech Co Ltd (2014–2025)
The table below shows the annual total liabilities of Dongwoon Anatech Co Ltd from 2014 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | ₩40.71 Billion ≈ $27.59 Million |
+48.00% |
| 2024-12-31 | ₩27.50 Billion ≈ $18.64 Million |
+7.00% |
| 2023-12-31 | ₩25.71 Billion ≈ $17.42 Million |
-38.63% |
| 2022-12-31 | ₩41.89 Billion ≈ $28.39 Million |
-2.09% |
| 2021-12-31 | ₩42.78 Billion ≈ $28.99 Million |
+6.03% |
| 2020-12-31 | ₩40.35 Billion ≈ $27.34 Million |
+37.63% |
| 2019-12-31 | ₩29.32 Billion ≈ $19.87 Million |
+39.43% |
| 2018-12-31 | ₩21.03 Billion ≈ $14.25 Million |
+28.29% |
| 2017-12-31 | ₩16.39 Billion ≈ $11.11 Million |
+63.99% |
| 2016-12-31 | ₩9.99 Billion ≈ $6.77 Million |
+23.80% |
| 2015-12-31 | ₩8.07 Billion ≈ $5.47 Million |
-36.57% |
| 2014-12-31 | ₩12.73 Billion ≈ $8.63 Million |
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About Dongwoon Anatech Co Ltd
Dongwoon Anatech Co., Ltd. manufactures and sells analog semiconductors in South Korea, China, Taiwan, Japan, and internationally. The company offers ICs for image stabilization, auto focus (AF) control in smartphone cameras, haptic driver ICs for automotive, various motor driver ICs, power management ICs, and ICs for LiDAR and ToF applications, as well as fingerprint recognition and saliva gluco… Read more