AnaPass Inc (123860) - Total Liabilities

Latest as of September 2025: ₩50.37 Billion KRW ≈ $34.13 Million USD

Based on the latest financial reports, AnaPass Inc (123860) has total liabilities worth ₩50.37 Billion KRW (≈ $34.13 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore how efficiently does AnaPass Inc generate cash to assess how effectively this company generates cash.

AnaPass Inc - Total Liabilities Trend (2014–2024)

This chart illustrates how AnaPass Inc's total liabilities have evolved over time, based on quarterly financial data. Check 123860 asset liquidity ratio to evaluate the company's liquid asset resilience ratio.

AnaPass Inc Competitors by Total Liabilities

The table below lists competitors of AnaPass Inc ranked by their total liabilities.

Company Country Total Liabilities
JTC Inc
KQ:950170
Korea ₩168.85 Billion
Wafangdian Bearing Co Ltd
SHE:200706
China HK$2.78 Billion
NSE SA
PA:ALNSE
France €53.41 Million
Bny Mellon Municipal Income Inc
NYSE MKT:DMF
USA $81.91 Million
Scicom MSC Bhd
KLSE:0099
Malaysia RM37.09 Million
C&G Hi Tech Co.Ltd
KQ:264660
Korea ₩49.24 Billion
Hardwyn India Limited
NSE:HARDWYN
India Rs756.38 Million
Clal Industries and Beverages Ltd
TA:CLBV
Israel ILA309.55 Million

Liability Composition Analysis (2014–2024)

This chart breaks down AnaPass Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 123860 market cap overview.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.51 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.60 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.38 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how AnaPass Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for AnaPass Inc (2014–2024)

The table below shows the annual total liabilities of AnaPass Inc from 2014 to 2024.

Year Total Liabilities Change
2024-12-31 ₩44.91 Billion
≈ $30.44 Million
-22.65%
2023-12-31 ₩58.06 Billion
≈ $39.35 Million
-11.17%
2022-12-31 ₩65.37 Billion
≈ $44.30 Million
+10.46%
2021-12-31 ₩59.18 Billion
≈ $40.10 Million
-20.19%
2020-12-31 ₩74.15 Billion
≈ $50.25 Million
+7.02%
2019-12-31 ₩69.29 Billion
≈ $46.95 Million
+190.89%
2018-12-31 ₩23.82 Billion
≈ $16.14 Million
+15.57%
2017-12-31 ₩20.61 Billion
≈ $13.97 Million
-8.99%
2016-12-31 ₩22.65 Billion
≈ $15.35 Million
+12.74%
2015-12-31 ₩20.09 Billion
≈ $13.61 Million
-20.55%
2014-12-31 ₩25.28 Billion
≈ $17.13 Million
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About AnaPass Inc

KQ:123860 Korea Semiconductors
Market Cap
$143.78 Million
₩212.16 Billion KRW
Market Cap Rank
#17802 Global
#856 in Korea
Share Price
₩17500.00
Change (1 day)
-0.17%
52-Week Range
₩14320.00 - ₩20400.00
All Time High
₩38000.26
About

Anapass, Inc. operates as a SoC semiconductor provider in the display market in South Korea. The company offers Timing Controller (TCON) Embedded Driver ICs that operates and controls smartphone display panels by integrating the functions of the panel timing control, memory, source driver, power control, LTPS, and gamma, etc.; TCONs, an IC that delivers the video signal from the application proce… Read more