NH SPAC 8 (218410) - Total Liabilities

Latest as of September 2025: ₩129.85 Billion KRW ≈ $88.00 Million USD

Based on the latest financial reports, NH SPAC 8 (218410) has total liabilities worth ₩129.85 Billion KRW (≈ $88.00 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 218410 cash flow conversion to assess how effectively this company generates cash.

NH SPAC 8 - Total Liabilities Trend (2016–2024)

This chart illustrates how NH SPAC 8's total liabilities have evolved over time, based on quarterly financial data. Check 218410 cash and liquid asset ratio to evaluate the company's liquid asset resilience ratio.

NH SPAC 8 Competitors by Total Liabilities

The table below lists competitors of NH SPAC 8 ranked by their total liabilities.

Company Country Total Liabilities
Success Electronics Ltd
SHE:002289
China CN¥201.30 Million
SM Entertainment Co. Ltd
KQ:041510
Korea ₩648.97 Billion
Yantai China Pet Foods Co Ltd
SHE:002891
China CN¥2.26 Billion
Flight Centre Travel Group Ltd
AU:FLT
Australia AU$3.47 Billion
Daejoo Electronic Materials Co. Ltd
KQ:078600
Korea ₩399.01 Billion
Universal Technical Institute Inc
NYSE:UTI
USA $498.03 Million
UFP Technologies Inc
NASDAQ:UFPT
USA $248.91 Million
Shenzhen MeiG Smart Technology Co Ltd
SHE:002881
China CN¥1.17 Billion

Liability Composition Analysis (2016–2024)

This chart breaks down NH SPAC 8's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see NH SPAC 8 stock valuation.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.57 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.40 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.26 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how NH SPAC 8's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for NH SPAC 8 (2016–2024)

The table below shows the annual total liabilities of NH SPAC 8 from 2016 to 2024.

Year Total Liabilities Change
2024-12-31 ₩124.99 Billion
≈ $84.70 Million
-30.99%
2023-12-31 ₩181.12 Billion
≈ $122.75 Million
-10.18%
2022-12-31 ₩201.66 Billion
≈ $136.66 Million
+20.99%
2021-12-31 ₩166.68 Billion
≈ $112.96 Million
+44.62%
2020-12-31 ₩115.26 Billion
≈ $78.11 Million
+88.56%
2019-12-31 ₩61.12 Billion
≈ $41.42 Million
-21.34%
2018-12-31 ₩77.70 Billion
≈ $52.66 Million
+143.18%
2017-12-31 ₩31.95 Billion
≈ $21.65 Million
+1903.20%
2016-12-31 ₩1.60 Billion
≈ $1.08 Million
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About NH SPAC 8

KQ:218410 Korea Semiconductors & Semiconductor Equipment
Market Cap
$1.50 Billion
₩2.21 Trillion KRW
Market Cap Rank
#7400 Global
#210 in Korea
Share Price
₩94300.00
Change (1 day)
+2.95%
52-Week Range
₩15550.00 - ₩105500.00
All Time High
₩105500.00
About

RFHIC Corporation designs and manufactures radio frequency (RF) and microwave components for wireless infrastructure, commercial and military radar, and industrial/scientific/medical industries in South Korea and internationally. The company's products include RF power transistors comprising gallium nitride (GaN) on SiC transistors; GaN and GaAs MMICs, and active dividers; power amplifiers, such … Read more