Zhengzhou GL Tech Co Ltd (300480) - Total Liabilities
Based on the latest financial reports, Zhengzhou GL Tech Co Ltd (300480) has total liabilities worth CN¥641.74 Million CNY (≈ $93.91 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Zhengzhou GL Tech Co Ltd - Total Liabilities Trend (2011–2024)
This chart illustrates how Zhengzhou GL Tech Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See working capital position of Zhengzhou GL Tech Co Ltd to evaluate short-term liquidity relative to the company's equity base.
Zhengzhou GL Tech Co Ltd Competitors by Total Liabilities
The table below lists competitors of Zhengzhou GL Tech Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Basic Fit NV
AS:BFIT
|
Netherlands | €3.56 Billion |
|
Elekta AB (publ)
ST:EKTA-B
|
Sweden | Skr19.67 Billion |
|
Yankershop Food Co Ltd
SHE:002847
|
China | CN¥2.10 Billion |
|
LDR Turizm AS
IS:LIDER
|
Turkey | TL3.37 Billion |
|
Partner
TA:PTNR
|
Israel | ILA2.38 Billion |
|
Jinyu Bio-Technology Co Ltd
SHG:600201
|
China | CN¥972.88 Million |
|
Nyocor Co Ltd
SHG:600821
|
China | CN¥29.03 Billion |
|
Allied Blenders & Distillers Ltd
NSE:ABDL
|
India | Rs19.72 Billion |
Liability Composition Analysis (2011–2024)
This chart breaks down Zhengzhou GL Tech Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market cap of Zhengzhou GL Tech Co Ltd.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 6.46 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.49 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.33 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Zhengzhou GL Tech Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Zhengzhou GL Tech Co Ltd (2011–2024)
The table below shows the annual total liabilities of Zhengzhou GL Tech Co Ltd from 2011 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥666.48 Million ≈ $97.53 Million |
+6.56% |
| 2023-12-31 | CN¥625.47 Million ≈ $91.53 Million |
+66.20% |
| 2022-12-31 | CN¥376.33 Million ≈ $55.07 Million |
+2.33% |
| 2021-12-31 | CN¥367.76 Million ≈ $53.81 Million |
+135.29% |
| 2020-12-31 | CN¥156.30 Million ≈ $22.87 Million |
+6.05% |
| 2019-12-31 | CN¥147.39 Million ≈ $21.57 Million |
+49.06% |
| 2018-12-31 | CN¥98.88 Million ≈ $14.47 Million |
+20.69% |
| 2017-12-31 | CN¥81.93 Million ≈ $11.99 Million |
+10.25% |
| 2016-12-31 | CN¥74.32 Million ≈ $10.87 Million |
+59.54% |
| 2015-12-31 | CN¥46.58 Million ≈ $6.82 Million |
-34.79% |
| 2014-12-31 | CN¥71.43 Million ≈ $10.45 Million |
+17.04% |
| 2013-12-31 | CN¥61.03 Million ≈ $8.93 Million |
+12.64% |
| 2012-12-31 | CN¥54.18 Million ≈ $7.93 Million |
-7.86% |
| 2011-12-31 | CN¥58.81 Million ≈ $8.61 Million |
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About Zhengzhou GL Tech Co Ltd
GL Tech Co.,Ltd provides safety production monitoring equipment and semiconductor packaging and testing equipment in China and internationally. The company offers semiconductor cutting, dicing, and thinning machines for wafer cutting, package cutting, and wafer thinning process in packaging and testing. It also offers sensors, transmitters, detection instruments, control systems, safety equipment… Read more