GigaDevice Semiconductor(Beiji (603986) - Total Liabilities
Based on the latest financial reports, GigaDevice Semiconductor(Beiji (603986) has total liabilities worth CN¥2.26 Billion CNY (≈ $330.53 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
GigaDevice Semiconductor(Beiji - Total Liabilities Trend (2011–2025)
This chart illustrates how GigaDevice Semiconductor(Beiji's total liabilities have evolved over time, based on quarterly financial data. See GigaDevice Semiconductor(Beiji current assets vs equity to evaluate short-term liquidity relative to the company's equity base.
GigaDevice Semiconductor(Beiji Competitors by Total Liabilities
The table below lists competitors of GigaDevice Semiconductor(Beiji ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
NetEase Inc
F:NEH
|
Germany | €53.56 Billion |
|
Fortinet Inc
NASDAQ:FTNT
|
USA | $9.15 Billion |
|
Hewlett Packard Enterprise Co
NYSE:HPE
|
USA | $54.22 Billion |
|
National Bank of Canada
TO:NA
|
Canada | CA$584.15 Billion |
|
Rocket Lab USA Inc.
NASDAQ:RKLB
|
USA | $555.57 Million |
|
Vale S.A
F:CVLB
|
Germany | €50.04 Billion |
|
Ciena Corp
NYSE:CIEN
|
USA | $3.10 Billion |
Liability Composition Analysis (2011–2025)
This chart breaks down GigaDevice Semiconductor(Beiji's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see GigaDevice Semiconductor(Beiji market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 9.66 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.09 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.08 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how GigaDevice Semiconductor(Beiji's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for GigaDevice Semiconductor(Beiji (2011–2025)
The table below shows the annual total liabilities of GigaDevice Semiconductor(Beiji from 2011 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥2.17 Billion ≈ $318.09 Million |
-14.76% |
| 2024-12-31 | CN¥2.55 Billion ≈ $373.15 Million |
+103.00% |
| 2023-12-31 | CN¥1.26 Billion ≈ $183.82 Million |
-13.93% |
| 2022-12-31 | CN¥1.46 Billion ≈ $213.58 Million |
-24.58% |
| 2021-12-31 | CN¥1.94 Billion ≈ $283.20 Million |
+90.34% |
| 2020-12-31 | CN¥1.02 Billion ≈ $148.78 Million |
+7.31% |
| 2019-12-31 | CN¥947.48 Million ≈ $138.65 Million |
-1.68% |
| 2018-12-31 | CN¥963.65 Million ≈ $141.01 Million |
+17.93% |
| 2017-12-31 | CN¥817.14 Million ≈ $119.57 Million |
+109.24% |
| 2016-12-31 | CN¥390.53 Million ≈ $57.15 Million |
+18.64% |
| 2015-12-31 | CN¥329.17 Million ≈ $48.17 Million |
+52.10% |
| 2014-12-31 | CN¥216.42 Million ≈ $31.67 Million |
+51.18% |
| 2013-12-31 | CN¥143.15 Million ≈ $20.95 Million |
-3.21% |
| 2012-12-31 | CN¥147.90 Million ≈ $21.64 Million |
+55.10% |
| 2011-12-31 | CN¥95.36 Million ≈ $13.95 Million |
-- |
About GigaDevice Semiconductor(Beiji
GigaDevice Semiconductor Inc. engages in the research, development, technical support, and sale of memory, microcontrollers, sensors, and analog chips. The company offers SPI NOR, SPI NAND, parallel NAND, wafer level chip scale packaging (WLCSP), and known good die (KGD) flash products; 32-bit microcontrollers (MCUs), such as high-performance, mainstream, entry-level, low-power consumptions, auto… Read more