Winpac Inc - Asset Resilience Ratio

Latest as of June 2025: 0.19%

Winpac Inc (097800) has an Asset Resilience Ratio of 0.19% as of June 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Winpac Inc (097800) liquidity to equity ratio to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

₩273.92 Million
≈ $185.63K USD Cash + Short-term Investments

Total Assets

₩140.74 Billion
≈ $95.38 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2016–2024)

This chart shows how Winpac Inc's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see total assets of Winpac Inc.

Liquid Assets Composition Over Time

This chart breaks down Winpac Inc's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Explore 097800 long-term investment intensity to see how much of total assets are deployed in long-term investments.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents ₩0.00 0%
Short-term Investments ₩273.92 Million 0.19%
Total Liquid Assets ₩273.92 Million 0.19%

Asset Resilience Insights

  • Limited Liquidity: Winpac Inc maintains only 0.19% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Winpac Inc Industry Peers by Asset Resilience Ratio

Compare Winpac Inc's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
GlobalWafers Co Ltd
TWO:6488
Semiconductors 20.19%
Yangzhou Yangjie Electronic Technology Co Ltd
SHE:300373
Semiconductors 3.51%
Shenzhen China Micro Semicon Co. Ltd. A
SHG:688380
Semiconductors 20.92%
Shenzhen Injoinic Technology Co. Ltd. A
SHG:688209
Semiconductors 8.09%
Motorcomm Electronic Technology Co. Ltd. A
SHG:688515
Semiconductors 24.81%
Nations Technologies Inc
SHE:300077
Semiconductors 2.23%
Shenzhen Bluetrum Technology Co. Ltd. A
SHG:688332
Semiconductors 31.30%
Sunplus Technology Co Ltd
TW:2401
Semiconductors 8.38%

Annual Asset Resilience Ratio for Winpac Inc (2016–2024)

The table below shows the annual Asset Resilience Ratio data for Winpac Inc.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 5.26% ₩7.53 Billion
≈ $5.10 Million
₩143.11 Billion
≈ $96.98 Million
+0.60pp
2023-12-31 4.66% ₩6.97 Billion
≈ $4.72 Million
₩149.51 Billion
≈ $101.32 Million
+2.78pp
2022-12-31 1.88% ₩3.36 Billion
≈ $2.28 Million
₩178.54 Billion
≈ $121.00 Million
-2.98pp
2021-12-31 4.87% ₩7.57 Billion
≈ $5.13 Million
₩155.52 Billion
≈ $105.39 Million
-3.35pp
2020-12-31 8.21% ₩11.02 Billion
≈ $7.47 Million
₩134.22 Billion
≈ $90.96 Million
+2.68pp
2019-12-31 5.53% ₩6.49 Billion
≈ $4.40 Million
₩117.48 Billion
≈ $79.61 Million
+1.91pp
2018-12-31 3.62% ₩2.72 Billion
≈ $1.84 Million
₩75.07 Billion
≈ $50.88 Million
-13.95pp
2017-12-31 17.56% ₩12.50 Billion
≈ $8.47 Million
₩71.16 Billion
≈ $48.22 Million
+16.96pp
2016-12-31 0.60% ₩423.94 Million
≈ $287.30K
₩70.78 Billion
≈ $47.96 Million
--
pp = percentage points

About Winpac Inc

KQ:097800 Korea Semiconductors
Market Cap
$168.09 Million
₩248.04 Billion KRW
Market Cap Rank
#17295 Global
#685 in Korea
Share Price
₩2130.00
Change (1 day)
+2.65%
52-Week Range
₩390.00 - ₩3005.00
All Time High
₩5377.29
About

WINPAC Inc. produces and sells semiconductor packaging and testing solutions in South Korea. Its packaging products comprise fine pitch ball grid array typed packages for flash/SRAM/fast SRAM, flash/SRAM MCP/DRAM, and ASIC/logic/analog IC packaging; land grid array type packages for PC, memory, DDR2, graphic memory, and mobile phone packaging; and POP and flip chip package products. The company's… Read more