Winpac Inc Total Liabilities
Winpac Inc total liabilities. Based on the latest financial reports, Winpac Inc (097800) has total liabilities worth ₩73.42 Billion KRW (≈ $49.76 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check financial resilience of Winpac Inc to evaluate the company's liquid asset resilience ratio.
Total Liabilities of Winpac Inc (2014–2024)
Total liabilities of Winpac Inc from 2014 to 2024. This chart illustrates how Winpac Inc's total liabilities have evolved over time, based on quarterly financial data. Explore 097800 long-term investment intensity to see how much of total assets are deployed in long-term investments.
Winpac Inc Competitors by Total Liabilities
The table below lists competitors of Winpac Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Asia Electronic Material Co Ltd
TWO:4939
|
Taiwan | NT$1.45 Billion |
|
Invesco Pennsylvania Value Municipal Income Trust
NYSE:VPV
|
USA | $114.03 Million |
|
Syncom Formulations (India) Limited
NSE:SYNCOMF
|
India | Rs775.88 Million |
|
Iljin Holdings
KO:015860
|
Korea | ₩1.19 Trillion |
|
Dongkuk Steel Mill Co Ltd
KO:001230
|
Korea | ₩954.63 Billion |
|
Hillgrove Resources Ltd
AU:HGO
|
Australia | AU$52.83 Million |
|
Amcil Ltd
AU:AMH
|
Australia | AU$27.81 Million |
|
Volati AB
ST:VOLO
|
Sweden | Skr6.46 Billion |
Liability Composition Analysis (2014–2024)
This chart breaks down Winpac Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see 097800 total asset value.
Liquidity & Leverage Metrics
Winpac Inc Total Liabilities Ratios Explained
Winpac Inc total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.50 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.11 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.53 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Winpac Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Winpac Inc (2014–2024)
The table below shows the annual total liabilities of Winpac Inc from 2014 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | ₩76.95 Billion ≈ $52.15 Million |
-25.13% |
| 2023-12-31 | ₩102.78 Billion ≈ $69.65 Million |
+0.38% |
| 2022-12-31 | ₩102.39 Billion ≈ $69.39 Million |
+14.20% |
| 2021-12-31 | ₩89.66 Billion ≈ $60.76 Million |
+9.00% |
| 2020-12-31 | ₩82.26 Billion ≈ $55.74 Million |
+16.79% |
| 2019-12-31 | ₩70.43 Billion ≈ $47.73 Million |
+85.87% |
| 2018-12-31 | ₩37.89 Billion ≈ $25.68 Million |
-0.12% |
| 2017-12-31 | ₩37.94 Billion ≈ $25.71 Million |
-18.66% |
| 2016-12-31 | ₩46.64 Billion ≈ $31.61 Million |
+1.94% |
| 2015-12-31 | ₩45.75 Billion ≈ $31.00 Million |
-11.25% |
| 2014-12-31 | ₩51.55 Billion ≈ $34.93 Million |
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About Winpac Inc
WINPAC Inc. produces and sells semiconductor packaging and testing solutions in South Korea. Its packaging products comprise fine pitch ball grid array typed packages for flash/SRAM/fast SRAM, flash/SRAM MCP/DRAM, and ASIC/logic/analog IC packaging; land grid array type packages for PC, memory, DDR2, graphic memory, and mobile phone packaging; and POP and flip chip package products. The company's… Read more