Winpac Inc Total Liabilities

Latest as of September 2025: ₩73.42 Billion KRW ≈ $49.76 Million USD

Winpac Inc total liabilities. Based on the latest financial reports, Winpac Inc (097800) has total liabilities worth ₩73.42 Billion KRW (≈ $49.76 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check financial resilience of Winpac Inc to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Winpac Inc (2014–2024)

Total liabilities of Winpac Inc from 2014 to 2024. This chart illustrates how Winpac Inc's total liabilities have evolved over time, based on quarterly financial data. Explore 097800 long-term investment intensity to see how much of total assets are deployed in long-term investments.

Winpac Inc Competitors by Total Liabilities

The table below lists competitors of Winpac Inc ranked by their total liabilities.

Company Country Total Liabilities
Asia Electronic Material Co Ltd
TWO:4939
Taiwan NT$1.45 Billion
Invesco Pennsylvania Value Municipal Income Trust
NYSE:VPV
USA $114.03 Million
Syncom Formulations (India) Limited
NSE:SYNCOMF
India Rs775.88 Million
Iljin Holdings
KO:015860
Korea ₩1.19 Trillion
Dongkuk Steel Mill Co Ltd
KO:001230
Korea ₩954.63 Billion
Hillgrove Resources Ltd
AU:HGO
Australia AU$52.83 Million
Amcil Ltd
AU:AMH
Australia AU$27.81 Million
Volati AB
ST:VOLO
Sweden Skr6.46 Billion

Liability Composition Analysis (2014–2024)

This chart breaks down Winpac Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see 097800 total asset value.

Liquidity & Leverage Metrics

Winpac Inc Total Liabilities Ratios Explained

Winpac Inc total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 0.50 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.11 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.53 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Winpac Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Winpac Inc (2014–2024)

The table below shows the annual total liabilities of Winpac Inc from 2014 to 2024.

Year Total Liabilities Change
2024-12-31 ₩76.95 Billion
≈ $52.15 Million
-25.13%
2023-12-31 ₩102.78 Billion
≈ $69.65 Million
+0.38%
2022-12-31 ₩102.39 Billion
≈ $69.39 Million
+14.20%
2021-12-31 ₩89.66 Billion
≈ $60.76 Million
+9.00%
2020-12-31 ₩82.26 Billion
≈ $55.74 Million
+16.79%
2019-12-31 ₩70.43 Billion
≈ $47.73 Million
+85.87%
2018-12-31 ₩37.89 Billion
≈ $25.68 Million
-0.12%
2017-12-31 ₩37.94 Billion
≈ $25.71 Million
-18.66%
2016-12-31 ₩46.64 Billion
≈ $31.61 Million
+1.94%
2015-12-31 ₩45.75 Billion
≈ $31.00 Million
-11.25%
2014-12-31 ₩51.55 Billion
≈ $34.93 Million
--

About Winpac Inc

KQ:097800 Korea Semiconductors
Market Cap
$193.74 Million
₩285.89 Billion KRW
Market Cap Rank
#16446 Global
#606 in Korea
Share Price
₩2455.00
Change (1 day)
-7.36%
52-Week Range
₩390.00 - ₩4065.00
All Time High
₩5377.29
About

WINPAC Inc. produces and sells semiconductor packaging and testing solutions in South Korea. Its packaging products comprise fine pitch ball grid array typed packages for flash/SRAM/fast SRAM, flash/SRAM MCP/DRAM, and ASIC/logic/analog IC packaging; land grid array type packages for PC, memory, DDR2, graphic memory, and mobile phone packaging; and POP and flip chip package products. The company's… Read more