Chipbond Technology - Asset Resilience Ratio
Chipbond Technology (6147) has an Asset Resilience Ratio of 1.28% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Chipbond Technology (6147) working capital ratio to evaluate short-term liquidity relative to the company's equity base.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2006–2024)
This chart shows how Chipbond Technology's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see Chipbond Technology total assets.
Liquid Assets Composition Over Time
This chart breaks down Chipbond Technology's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Read Chipbond Technology debt and liabilities for a breakdown of total debt and financial obligations.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$709.91 Million | 1.28% |
| Total Liquid Assets | NT$709.91 Million | 1.28% |
Asset Resilience Insights
- Limited Liquidity: Chipbond Technology maintains only 1.28% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Chipbond Technology Industry Peers by Asset Resilience Ratio
Compare Chipbond Technology's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
National Silicon Industry Group Co Ltd
SHG:688126 |
Semiconductor Equipment & Materials | 4.72% |
|
Henan Shijia Photons Technology Co Ltd
SHG:688313 |
Semiconductor Equipment & Materials | 0.39% |
|
Konfoong Materials International Co Ltd
SHE:300666 |
Semiconductor Equipment & Materials | 0.04% |
|
Suzhou Everbright Photonics Co. Ltd. A
SHG:688048 |
Semiconductor Equipment & Materials | 15.57% |
|
Tianshui Huatian Technology Co Ltd
SHE:002185 |
Semiconductor Equipment & Materials | 3.51% |
|
GRINM Semiconductor Materials Co. Ltd. A
SHG:688432 |
Semiconductor Equipment & Materials | 34.79% |
|
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401 |
Semiconductor Equipment & Materials | 4.11% |
|
SAMYANG NC Chem
KQ:482630 |
Semiconductor Equipment & Materials | 0.42% |
Annual Asset Resilience Ratio for Chipbond Technology (2006–2024)
The table below shows the annual Asset Resilience Ratio data for Chipbond Technology.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 0.01% | NT$5.00 Million ≈ $157.53K |
NT$52.02 Billion ≈ $1.64 Billion |
0.00pp |
| 2023-12-31 | 0.01% | NT$6.22 Million ≈ $195.93K |
NT$54.53 Billion ≈ $1.72 Billion |
+0.01pp |
| 2022-12-31 | 0.00% | NT$2.01 Million ≈ $63.26K |
NT$50.96 Billion ≈ $1.61 Billion |
-0.13pp |
| 2020-12-31 | 0.14% | NT$59.81 Million ≈ $1.88 Million |
NT$43.27 Billion ≈ $1.36 Billion |
-0.01pp |
| 2017-12-31 | 0.15% | NT$52.84 Million ≈ $1.66 Million |
NT$35.40 Billion ≈ $1.12 Billion |
-1.01pp |
| 2016-12-31 | 1.16% | NT$399.52 Million ≈ $12.59 Million |
NT$34.35 Billion ≈ $1.08 Billion |
+1.16pp |
| 2015-12-31 | 0.00% | NT$20.00K ≈ $630.11 |
NT$38.48 Billion ≈ $1.21 Billion |
-0.02pp |
| 2014-12-31 | 0.02% | NT$8.84 Million ≈ $278.54K |
NT$40.09 Billion ≈ $1.26 Billion |
+0.00pp |
| 2013-12-31 | 0.02% | NT$8.36 Million ≈ $263.42K |
NT$38.23 Billion ≈ $1.20 Billion |
-6.66pp |
| 2012-12-31 | 6.69% | NT$1.84 Billion ≈ $57.90 Million |
NT$27.49 Billion ≈ $865.98 Million |
+2.47pp |
| 2011-12-31 | 4.22% | NT$1.12 Billion ≈ $35.16 Million |
NT$26.46 Billion ≈ $833.70 Million |
+3.94pp |
| 2010-12-31 | 0.28% | NT$63.00 Million ≈ $1.98 Million |
NT$22.57 Billion ≈ $711.14 Million |
+0.02pp |
| 2009-12-31 | 0.26% | NT$28.00 Million ≈ $882.15K |
NT$10.97 Billion ≈ $345.63 Million |
-0.01pp |
| 2008-12-31 | 0.26% | NT$28.00 Million ≈ $882.15K |
NT$10.73 Billion ≈ $338.17 Million |
-3.82pp |
| 2007-12-31 | 4.08% | NT$490.83 Million ≈ $15.46 Million |
NT$12.04 Billion ≈ $379.23 Million |
+3.97pp |
| 2006-12-31 | 0.11% | NT$10.00 Million ≈ $315.05K |
NT$8.93 Billion ≈ $281.30 Million |
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About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more