Chipbond Technology - Asset Resilience Ratio
Chipbond Technology (6147) has an Asset Resilience Ratio of 0.01% as of March 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read Chipbond Technology (6147) total liabilities for a breakdown of total debt and financial obligations.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2006–2024)
This chart shows how Chipbond Technology's Asset Resilience Ratio has changed over time. See 6147 total equity for net asset value and shareholders' equity analysis.
Liquid Assets Composition Over Time
This chart breaks down Chipbond Technology's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see market cap of Chipbond Technology.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$5.01 Million | 0.01% |
| Total Liquid Assets | NT$5.01 Million | 0.01% |
Asset Resilience Insights
- Limited Liquidity: Chipbond Technology maintains only 0.01% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Chipbond Technology Industry Peers by Asset Resilience Ratio
Compare Chipbond Technology's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Suzhou Maxwell Technologies Co Ltd Class A
SHE:300751 |
Semiconductor Equipment & Materials | 1.49% |
|
LandMark Optoelectronics
TWO:3081 |
Semiconductor Equipment & Materials | 25.41% |
|
Keystone Microtech Corp
TWO:6683 |
Semiconductor Equipment & Materials | 0.29% |
|
Thinkon Semiconductor Jinzhou Corp
SHG:688233 |
Semiconductor Equipment & Materials | 10.01% |
|
JiLin Sino-Microelectronics Co Ltd
SHG:600360 |
Semiconductor Equipment & Materials | 8.45% |
|
YCC CORP
KQ:232140 |
Semiconductor Equipment & Materials | 14.52% |
|
Shih Her Technologies
TWO:3551 |
Semiconductor Equipment & Materials | 2.83% |
|
Mecaro Co. Ltd
KQ:241770 |
Semiconductor Equipment & Materials | 15.91% |
Annual Asset Resilience Ratio for Chipbond Technology (2006–2024)
The table below shows the annual Asset Resilience Ratio data for Chipbond Technology.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 0.01% | NT$5.00 Million ≈ $157.53K |
NT$52.02 Billion ≈ $1.64 Billion |
0.00pp |
| 2023-12-31 | 0.01% | NT$6.22 Million ≈ $195.93K |
NT$54.53 Billion ≈ $1.72 Billion |
+0.01pp |
| 2022-12-31 | 0.00% | NT$2.01 Million ≈ $63.26K |
NT$50.96 Billion ≈ $1.61 Billion |
-0.13pp |
| 2020-12-31 | 0.14% | NT$59.81 Million ≈ $1.88 Million |
NT$43.27 Billion ≈ $1.36 Billion |
-0.01pp |
| 2017-12-31 | 0.15% | NT$52.84 Million ≈ $1.66 Million |
NT$35.40 Billion ≈ $1.12 Billion |
-1.01pp |
| 2016-12-31 | 1.16% | NT$399.52 Million ≈ $12.59 Million |
NT$34.35 Billion ≈ $1.08 Billion |
+1.16pp |
| 2015-12-31 | 0.00% | NT$20.00K ≈ $630.11 |
NT$38.48 Billion ≈ $1.21 Billion |
-0.02pp |
| 2014-12-31 | 0.02% | NT$8.84 Million ≈ $278.54K |
NT$40.09 Billion ≈ $1.26 Billion |
+0.00pp |
| 2013-12-31 | 0.02% | NT$8.36 Million ≈ $263.42K |
NT$38.23 Billion ≈ $1.20 Billion |
-6.66pp |
| 2012-12-31 | 6.69% | NT$1.84 Billion ≈ $57.90 Million |
NT$27.49 Billion ≈ $865.98 Million |
+2.47pp |
| 2011-12-31 | 4.22% | NT$1.12 Billion ≈ $35.16 Million |
NT$26.46 Billion ≈ $833.70 Million |
+3.94pp |
| 2010-12-31 | 0.28% | NT$63.00 Million ≈ $1.98 Million |
NT$22.57 Billion ≈ $711.14 Million |
+0.02pp |
| 2009-12-31 | 0.26% | NT$28.00 Million ≈ $882.15K |
NT$10.97 Billion ≈ $345.63 Million |
-0.01pp |
| 2008-12-31 | 0.26% | NT$28.00 Million ≈ $882.15K |
NT$10.73 Billion ≈ $338.17 Million |
-3.82pp |
| 2007-12-31 | 4.08% | NT$490.83 Million ≈ $15.46 Million |
NT$12.04 Billion ≈ $379.23 Million |
+3.97pp |
| 2006-12-31 | 0.11% | NT$10.00 Million ≈ $315.05K |
NT$8.93 Billion ≈ $281.30 Million |
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About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer se… Read more