Chipbond Technology (6147) - Total Assets

Latest as of March 2026: NT$55.49 Billion TWD ≈ $1.75 Billion USD

Based on the latest financial reports, Chipbond Technology (6147) holds total assets worth NT$55.49 Billion TWD (≈ $1.75 Billion USD) as of March 2026. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments.

Chipbond Technology - Total Assets Trend (2006–2025)

This chart illustrates how Chipbond Technology's total assets have evolved over time, based on quarterly financial data. Also see Chipbond Technology (6147) market capitalisation for the company's overall valuation and market capitalisation.

Chipbond Technology - Asset Composition Analysis

Current Asset Composition (December 2025)

Chipbond Technology's total assets of NT$55.49 Billion consist of 26.9% current assets and 73.1% non-current assets. Review Chipbond Technology (6147) financial obligations to assess the company's total debt and financial obligations.

Asset Category	Amount (TWD)	% of Total Assets
Cash & Equivalents	NT$0.00	12.6%
Accounts Receivable	NT$4.12 Billion	7.6%
Inventory	NT$3.29 Billion	6.1%
Property, Plant & Equipment	NT$0.00	0.0%
Intangible Assets	NT$0.00	0.0%
Goodwill	NT$0.00	0.0%

Asset Composition Trend (2006–2025)

This chart illustrates how Chipbond Technology's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. See Chipbond Technology (6147) share price today for real-time trading data and today's change.

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Key Asset Composition Facts

Current vs. Non-Current Assets: Chipbond Technology's current assets represent 26.9% of total assets in 2025, a decrease from 30.2% in 2006.
Cash Position: Cash and equivalents constituted 12.6% of total assets in 2025, up from 11.4% in 2006.
Tangible vs. Intangible: Intangible assets (including goodwill) make up 0.0% of total assets, unchanged from 0.0% in 2006.
Asset Diversification: The largest asset category is accounts receivable at 7.6% of total assets.

Chipbond Technology Competitors by Total Assets

Key competitors of Chipbond Technology based on total assets are shown below.

Company	Country	Total Assets
National Silicon Industry Group Co Ltd SHG:688126	China	CN¥38.21 Billion
Henan Shijia Photons Technology Co Ltd SHG:688313	China	CN¥2.55 Billion
Konfoong Materials International Co Ltd SHE:300666	China	CN¥14.87 Billion
Suzhou Everbright Photonics Co. Ltd. A SHG:688048	China	CN¥3.33 Billion
Tianshui Huatian Technology Co Ltd SHE:002185	China	CN¥45.15 Billion
GRINM Semiconductor Materials Co. Ltd. A SHG:688432	China	CN¥5.29 Billion
Shenzhen Newway Photomask Making Co. Ltd. A SHG:688401	China	CN¥3.18 Billion
SAMYANG NC Chem KQ:482630	Korea	₩157.43 Billion

Chipbond Technology - Liquidity and Working Capital Analysis

Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.

Key Liquidity Metrics

Metric	Current	1 Year Ago	5 Years Ago
Current Ratio	2.44	2.28	1.58
Quick Ratio	1.82	1.87	1.36
Cash Ratio	0.00	0.00	0.00
Working Capital	NT$8.77 Billion	NT$7.98 Billion	NT$4.40 Billion

Chipbond Technology - Advanced Valuation Insights

This section examines the relationship between Chipbond Technology's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.

Key Valuation Metrics

Current Price-to-Book Ratio	2.57
Latest Market Cap to Assets Ratio	0.09
Asset Growth Rate (YoY)	4.2%
Total Assets	NT$54.23 Billion
Market Capitalization	$4.87 Billion USD

Valuation Analysis

Below Book Valuation: The market values Chipbond Technology's assets below their book value (0.09x), which may indicate investor concerns about asset quality or future growth.

Positive Asset Growth: Chipbond Technology's assets grew by 4.2% over the past year, showing continued investment in the company's operational capacity.

Annual Total Assets for Chipbond Technology (2006–2025)

The table below shows the annual total assets of Chipbond Technology from 2006 to 2025.

Year	Total Assets	Change
2025-12-31	NT$54.23 Billion ≈ $1.71 Billion	+4.24%
2024-12-31	NT$52.02 Billion ≈ $1.64 Billion	-4.59%
2023-12-31	NT$54.53 Billion ≈ $1.72 Billion	+7.01%
2022-12-31	NT$50.96 Billion ≈ $1.61 Billion	-5.29%
2021-12-31	NT$53.80 Billion ≈ $1.70 Billion	+24.35%
2020-12-31	NT$43.27 Billion ≈ $1.36 Billion	+7.58%
2019-12-31	NT$40.22 Billion ≈ $1.27 Billion	+1.54%
2018-12-31	NT$39.61 Billion ≈ $1.25 Billion	+11.89%
2017-12-31	NT$35.40 Billion ≈ $1.12 Billion	+3.05%
2016-12-31	NT$34.35 Billion ≈ $1.08 Billion	-10.73%
2015-12-31	NT$38.48 Billion ≈ $1.21 Billion	-4.02%
2014-12-31	NT$40.09 Billion ≈ $1.26 Billion	+4.87%
2013-12-31	NT$38.23 Billion ≈ $1.20 Billion	+39.08%
2012-12-31	NT$27.49 Billion ≈ $865.98 Million	+3.87%
2011-12-31	NT$26.46 Billion ≈ $833.70 Million	+17.24%
2010-12-31	NT$22.57 Billion ≈ $711.14 Million	+105.75%
2009-12-31	NT$10.97 Billion ≈ $345.63 Million	+2.20%
2008-12-31	NT$10.73 Billion ≈ $338.17 Million	-10.83%
2007-12-31	NT$12.04 Billion ≈ $379.23 Million	+34.81%
2006-12-31	NT$8.93 Billion ≈ $281.30 Million	--

About Chipbond Technology

TWO:6147 Taiwan Semiconductor Equipment & Materials

Market Cap

$4.87 Billion

NT$154.50 Billion TWD

Market Cap Rank

#3628 Global

#108 in Taiwan

Share Price

NT$207.50

Change (1 day)

+3.75%

52-Week Range

NT$51.20 - NT$305.50

All Time High

NT$305.50