Chipbond Technology (6147) - Total Assets

Latest as of December 2025: NT$54.23 Billion TWD ≈ $1.71 Billion USD

Based on the latest financial reports, Chipbond Technology (6147) holds total assets worth NT$54.23 Billion TWD (≈ $1.71 Billion USD) as of December 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. Check 6147 cash flow reinvestment rate to assess the company's total reinvestment commitment from operating cash flow.

Chipbond Technology - Total Assets Trend (2006–2025)

This chart illustrates how Chipbond Technology's total assets have evolved over time, based on quarterly financial data. Check Chipbond Technology cash earnings quality to evaluate the quality of earnings relative to operating cash generation.

Chipbond Technology - Asset Composition Analysis

Current Asset Composition (December 2025)

Chipbond Technology's total assets of NT$54.23 Billion consist of 26.9% current assets and 73.1% non-current assets.

Asset Category Amount (TWD) % of Total Assets
Cash & Equivalents NT$0.00 12.6%
Accounts Receivable NT$4.12 Billion 7.6%
Inventory NT$3.29 Billion 6.1%
Property, Plant & Equipment NT$0.00 0.0%
Intangible Assets NT$0.00 0.0%
Goodwill NT$0.00 0.0%

Asset Composition Trend (2006–2025)

This chart illustrates how Chipbond Technology's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see Chipbond Technology market capitalisation.

Key Asset Composition Facts

  • Current vs. Non-Current Assets: Chipbond Technology's current assets represent 26.9% of total assets in 2025, a decrease from 30.2% in 2006.
  • Cash Position: Cash and equivalents constituted 12.6% of total assets in 2025, up from 11.4% in 2006.
  • Tangible vs. Intangible: Intangible assets (including goodwill) make up 0.0% of total assets, unchanged from 0.0% in 2006.
  • Asset Diversification: The largest asset category is accounts receivable at 7.6% of total assets.

Chipbond Technology Competitors by Total Assets

Key competitors of Chipbond Technology based on total assets are shown below.

Company Country Total Assets
Skyverse Technology Co. Ltd. A
SHG:688361
China CN¥8.03 Billion
JHT Design Co. Ltd. Cl A
SHG:603061
China CN¥2.36 Billion
Wuxi Nce Power Co Ltd
SHG:605111
China CN¥4.68 Billion
JiLin Sino-Microelectronics Co Ltd
SHG:600360
China CN¥5.62 Billion
Zhejiang Mtcn Technology Co Ltd
SHE:003026
China CN¥1.26 Billion
Semco Technologies Sas
PA:ALSEM
France €35.29 Million
SAMYANG NC Chem
KQ:482630
Korea ₩144.80 Billion
Shih Her Technologies
TWO:3551
Taiwan NT$6.07 Billion

Chipbond Technology - Liquidity and Working Capital Analysis

Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.

Key Liquidity Metrics

Metric Current 1 Year Ago 5 Years Ago
Current Ratio 3.35 4.09 1.52
Quick Ratio 2.60 3.54 1.32
Cash Ratio 0.00 0.00 0.00
Working Capital NT$10.24 Billion NT$11.25 Billion NT$3.51 Billion

Chipbond Technology - Advanced Valuation Insights

This section examines the relationship between Chipbond Technology's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.

Key Valuation Metrics

Current Price-to-Book Ratio 3.11
Latest Market Cap to Assets Ratio 0.10
Asset Growth Rate (YoY) 4.2%
Total Assets NT$54.23 Billion
Market Capitalization $5.38 Billion USD

Valuation Analysis

Below Book Valuation: The market values Chipbond Technology's assets below their book value (0.10x), which may indicate investor concerns about asset quality or future growth.

Positive Asset Growth: Chipbond Technology's assets grew by 4.2% over the past year, showing continued investment in the company's operational capacity.

Annual Total Assets for Chipbond Technology (2006–2025)

The table below shows the annual total assets of Chipbond Technology from 2006 to 2025.

Year Total Assets Change
2025-12-31 NT$54.23 Billion
≈ $1.71 Billion
+4.24%
2024-12-31 NT$52.02 Billion
≈ $1.64 Billion
-4.59%
2023-12-31 NT$54.53 Billion
≈ $1.72 Billion
+7.01%
2022-12-31 NT$50.96 Billion
≈ $1.61 Billion
-5.29%
2021-12-31 NT$53.80 Billion
≈ $1.70 Billion
+24.35%
2020-12-31 NT$43.27 Billion
≈ $1.36 Billion
+7.58%
2019-12-31 NT$40.22 Billion
≈ $1.27 Billion
+1.54%
2018-12-31 NT$39.61 Billion
≈ $1.25 Billion
+11.89%
2017-12-31 NT$35.40 Billion
≈ $1.12 Billion
+3.05%
2016-12-31 NT$34.35 Billion
≈ $1.08 Billion
-10.73%
2015-12-31 NT$38.48 Billion
≈ $1.21 Billion
-4.02%
2014-12-31 NT$40.09 Billion
≈ $1.26 Billion
+4.87%
2013-12-31 NT$38.23 Billion
≈ $1.20 Billion
+39.08%
2012-12-31 NT$27.49 Billion
≈ $865.98 Million
+3.87%
2011-12-31 NT$26.46 Billion
≈ $833.70 Million
+17.24%
2010-12-31 NT$22.57 Billion
≈ $711.14 Million
+105.75%
2009-12-31 NT$10.97 Billion
≈ $345.63 Million
+2.20%
2008-12-31 NT$10.73 Billion
≈ $338.17 Million
-10.83%
2007-12-31 NT$12.04 Billion
≈ $379.23 Million
+34.81%
2006-12-31 NT$8.93 Billion
≈ $281.30 Million
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About Chipbond Technology

TWO:6147 Taiwan Semiconductor Equipment & Materials
Market Cap
$5.38 Billion
NT$170.88 Billion TWD
Market Cap Rank
#3442 Global
#105 in Taiwan
Share Price
NT$229.50
Change (1 day)
+2.14%
52-Week Range
NT$51.20 - NT$305.50
All Time High
NT$305.50
About

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more