Chipbond Technology (6147) - Total Assets
Based on the latest financial reports, Chipbond Technology (6147) holds total assets worth NT$54.23 Billion TWD (≈ $1.71 Billion USD) as of December 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. Explore Chipbond Technology debt service capacity to assess how comfortably operating cash covers total debt obligations.
Chipbond Technology - Total Assets Trend (2006–2025)
This chart illustrates how Chipbond Technology's total assets have evolved over time, based on quarterly financial data. See 6147 total equity for net asset value and shareholders' equity analysis.
Chipbond Technology - Asset Composition Analysis
Current Asset Composition (December 2025)
Chipbond Technology's total assets of NT$54.23 Billion consist of 26.9% current assets and 73.1% non-current assets.
| Asset Category | Amount (TWD) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 12.6% |
| Accounts Receivable | NT$4.12 Billion | 7.6% |
| Inventory | NT$3.29 Billion | 6.1% |
| Property, Plant & Equipment | NT$0.00 | 0.0% |
| Intangible Assets | NT$0.00 | 0.0% |
| Goodwill | NT$0.00 | 0.0% |
Asset Composition Trend (2006–2025)
This chart illustrates how Chipbond Technology's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see Chipbond Technology (6147) total market value.
Key Asset Composition Facts
- Current vs. Non-Current Assets: Chipbond Technology's current assets represent 26.9% of total assets in 2025, a decrease from 30.2% in 2006.
- Cash Position: Cash and equivalents constituted 12.6% of total assets in 2025, up from 11.4% in 2006.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 0.0% of total assets, unchanged from 0.0% in 2006.
- Asset Diversification: The largest asset category is accounts receivable at 7.6% of total assets.
Chipbond Technology Competitors by Total Assets
Key competitors of Chipbond Technology based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
TongFu Microelectronics Co Ltd
SHE:002156
|
China | CN¥45.47 Billion |
|
Anji Microelectronics Tech Co Ltd
SHG:688019
|
China | CN¥5.45 Billion |
|
Beijing Huafeng Test & Control Technology Co Ltd
SHG:688200
|
China | CN¥3.94 Billion |
|
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401
|
China | CN¥3.18 Billion |
|
JHT Design Co. Ltd. Cl A
SHG:603061
|
China | CN¥2.36 Billion |
|
Adaptive Plasma Technology Corp
KQ:089970
|
Korea | ₩212.75 Billion |
|
Zhejiang Mtcn Technology Co Ltd
SHE:003026
|
China | CN¥1.26 Billion |
|
Spectra7 Microsystems Inc
V:SEV
|
Canada | CA$3.23 Million |
Chipbond Technology - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 3.35 | 4.09 | 1.52 |
| Quick Ratio | 2.60 | 3.54 | 1.32 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | NT$10.24 Billion | NT$11.25 Billion | NT$3.51 Billion |
Chipbond Technology - Advanced Valuation Insights
This section examines the relationship between Chipbond Technology's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 3.11 |
| Latest Market Cap to Assets Ratio | 0.06 |
| Asset Growth Rate (YoY) | 4.2% |
| Total Assets | NT$54.23 Billion |
| Market Capitalization | $3.05 Billion USD |
Valuation Analysis
Below Book Valuation: The market values Chipbond Technology's assets below their book value (0.06x), which may indicate investor concerns about asset quality or future growth.
Positive Asset Growth: Chipbond Technology's assets grew by 4.2% over the past year, showing continued investment in the company's operational capacity.
Annual Total Assets for Chipbond Technology (2006–2025)
The table below shows the annual total assets of Chipbond Technology from 2006 to 2025.
| Year | Total Assets | Change |
|---|---|---|
| 2025-12-31 | NT$54.23 Billion ≈ $1.71 Billion |
+4.24% |
| 2024-12-31 | NT$52.02 Billion ≈ $1.64 Billion |
-4.59% |
| 2023-12-31 | NT$54.53 Billion ≈ $1.72 Billion |
+7.01% |
| 2022-12-31 | NT$50.96 Billion ≈ $1.61 Billion |
-5.29% |
| 2021-12-31 | NT$53.80 Billion ≈ $1.70 Billion |
+24.35% |
| 2020-12-31 | NT$43.27 Billion ≈ $1.36 Billion |
+7.58% |
| 2019-12-31 | NT$40.22 Billion ≈ $1.27 Billion |
+1.54% |
| 2018-12-31 | NT$39.61 Billion ≈ $1.25 Billion |
+11.89% |
| 2017-12-31 | NT$35.40 Billion ≈ $1.12 Billion |
+3.05% |
| 2016-12-31 | NT$34.35 Billion ≈ $1.08 Billion |
-10.73% |
| 2015-12-31 | NT$38.48 Billion ≈ $1.21 Billion |
-4.02% |
| 2014-12-31 | NT$40.09 Billion ≈ $1.26 Billion |
+4.87% |
| 2013-12-31 | NT$38.23 Billion ≈ $1.20 Billion |
+39.08% |
| 2012-12-31 | NT$27.49 Billion ≈ $865.98 Million |
+3.87% |
| 2011-12-31 | NT$26.46 Billion ≈ $833.70 Million |
+17.24% |
| 2010-12-31 | NT$22.57 Billion ≈ $711.14 Million |
+105.75% |
| 2009-12-31 | NT$10.97 Billion ≈ $345.63 Million |
+2.20% |
| 2008-12-31 | NT$10.73 Billion ≈ $338.17 Million |
-10.83% |
| 2007-12-31 | NT$12.04 Billion ≈ $379.23 Million |
+34.81% |
| 2006-12-31 | NT$8.93 Billion ≈ $281.30 Million |
-- |
About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more