Chipbond Technology (6147) - Cash Flow Conversion Efficiency
Based on the latest financial reports, Chipbond Technology (6147) has a cash flow conversion efficiency ratio of 0.042x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (NT$1.99 Billion ≈ $62.73 Million USD) by net assets (NT$47.37 Billion ≈ $1.49 Billion USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See Chipbond Technology (6147) defensive interval to measure how many days the company can operate on defensive assets alone.
Chipbond Technology - Cash Flow Conversion Efficiency Trend (2006–2025)
This chart illustrates how Chipbond Technology's cash flow conversion efficiency has evolved over time, based on yearly financial data.
Chipbond Technology Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of Chipbond Technology ranked by their cash flow conversion efficiency.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Baic Bluepark New Energy Technology
SHG:600733
|
-0.273x |
|
AMMB Holdings Bhd
KLSE:1015
|
0.007x |
|
Open Text Corp
TO:OTEX
|
0.079x |
|
Hindustan Copper Limited
NSE:HINDCOPPER
|
0.144x |
|
Paylocity Holding Corporation
NASDAQ:PCTY
|
0.185x |
|
BRF SA ADR
NYSE:BRFS
|
0.142x |
|
Versant Media Group, Inc.
NASDAQ:VSNT
|
0.046x |
|
Oberbank AG
VI:OBS
|
-0.099x |
Annual Cash Flow Conversion Efficiency for Chipbond Technology (2006–2025)
The table below shows the annual cash flow conversion efficiency of Chipbond Technology from 2006 to 2025. For the full company profile with market capitalisation and key ratios, see Chipbond Technology (6147) market capitalisation.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2025-12-31 | NT$47.37 Billion ≈ $1.49 Billion |
NT$3.55 Billion ≈ $111.80 Million |
0.075x | -33.78% |
| 2024-12-31 | NT$47.13 Billion ≈ $1.48 Billion |
NT$5.33 Billion ≈ $167.99 Million |
0.113x | -17.14% |
| 2023-12-31 | NT$48.48 Billion ≈ $1.53 Billion |
NT$6.62 Billion ≈ $208.52 Million |
0.137x | -46.55% |
| 2022-12-31 | NT$40.89 Billion ≈ $1.29 Billion |
NT$10.44 Billion ≈ $329.01 Million |
0.255x | +33.81% |
| 2021-12-31 | NT$41.68 Billion ≈ $1.31 Billion |
NT$7.95 Billion ≈ $250.61 Million |
0.191x | -0.95% |
| 2020-12-31 | NT$32.04 Billion ≈ $1.01 Billion |
NT$6.17 Billion ≈ $194.51 Million |
0.193x | -32.97% |
| 2019-12-31 | NT$29.69 Billion ≈ $935.45 Million |
NT$8.54 Billion ≈ $268.91 Million |
0.287x | +30.79% |
| 2018-12-31 | NT$27.87 Billion ≈ $878.14 Million |
NT$6.13 Billion ≈ $193.00 Million |
0.220x | +14.64% |
| 2017-12-31 | NT$25.34 Billion ≈ $798.41 Million |
NT$4.86 Billion ≈ $153.07 Million |
0.192x | +15.31% |
| 2016-12-31 | NT$24.48 Billion ≈ $771.18 Million |
NT$4.07 Billion ≈ $128.22 Million |
0.166x | -34.87% |
| 2015-12-31 | NT$24.24 Billion ≈ $763.80 Million |
NT$6.19 Billion ≈ $194.99 Million |
0.255x | +13.75% |
| 2014-12-31 | NT$23.96 Billion ≈ $754.98 Million |
NT$5.38 Billion ≈ $169.43 Million |
0.224x | -13.92% |
| 2013-12-31 | NT$22.64 Billion ≈ $713.35 Million |
NT$5.90 Billion ≈ $185.97 Million |
0.261x | +3.05% |
| 2012-12-31 | NT$18.13 Billion ≈ $571.07 Million |
NT$4.59 Billion ≈ $144.47 Million |
0.253x | -10.39% |
| 2011-12-31 | NT$16.78 Billion ≈ $528.59 Million |
NT$4.74 Billion ≈ $149.24 Million |
0.282x | +2.54% |
| 2010-12-31 | NT$15.66 Billion ≈ $493.46 Million |
NT$4.31 Billion ≈ $135.86 Million |
0.275x | -8.79% |
| 2009-12-31 | NT$6.16 Billion ≈ $194.11 Million |
NT$1.86 Billion ≈ $58.60 Million |
0.302x | -26.76% |
| 2008-12-31 | NT$5.56 Billion ≈ $175.07 Million |
NT$2.29 Billion ≈ $72.15 Million |
0.412x | +31.24% |
| 2007-12-31 | NT$6.34 Billion ≈ $199.86 Million |
NT$1.99 Billion ≈ $62.77 Million |
0.314x | +31.47% |
| 2006-12-31 | NT$5.37 Billion ≈ $169.17 Million |
NT$1.28 Billion ≈ $40.41 Million |
0.239x | -- |
About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more