Chipbond Technology (6147) - Cash Flow Conversion Efficiency
Based on the latest financial reports, Chipbond Technology (6147) has a cash flow conversion efficiency ratio of -0.009x as of March 2026. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (NT$-441.77 Million ≈ $-13.92 Million USD) by net assets (NT$46.88 Billion ≈ $1.48 Billion USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. Also see Chipbond Technology (6147) market capitalisation for the company's overall valuation and market capitalisation.
Chipbond Technology - Cash Flow Conversion Efficiency Trend (2006–2025)
This chart illustrates how Chipbond Technology's cash flow conversion efficiency has evolved over time, based on yearly financial data.
Chipbond Technology Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of Chipbond Technology ranked by their cash flow conversion efficiency. Explore 6147 cash flow quality score to measure how well operating cash flow supports reported net income.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Investec PLC
JSE:INP
|
-0.202x |
|
Chewy Inc
NYSE:CHWY
|
0.256x |
|
PERSIMMON UNSPON. ADR 2
F:OHP0
|
N/A |
|
Garrett Motion Inc
NASDAQ:GTX
|
-0.215x |
|
DELEK GP SP.ADR/1/01/O.N
F:6D40
|
0.004x |
|
TAL Education Group
NYSE:TAL
|
0.117x |
|
CSW Industrials, Inc.
NASDAQ:CSW
|
0.054x |
|
Virtu Financial, Inc.
NYSE:VIRT
|
-0.035x |
Annual Cash Flow Conversion Efficiency for Chipbond Technology (2006–2025)
The table below shows the annual cash flow conversion efficiency of Chipbond Technology from 2006 to 2025. View Chipbond Technology stock price for real-time trading data and today's change.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2025-12-31 | NT$47.37 Billion ≈ $1.49 Billion |
NT$3.55 Billion ≈ $111.80 Million |
0.075x | -33.78% |
| 2024-12-31 | NT$47.13 Billion ≈ $1.48 Billion |
NT$5.33 Billion ≈ $167.99 Million |
0.113x | -17.14% |
| 2023-12-31 | NT$48.48 Billion ≈ $1.53 Billion |
NT$6.62 Billion ≈ $208.52 Million |
0.137x | -46.55% |
| 2022-12-31 | NT$40.89 Billion ≈ $1.29 Billion |
NT$10.44 Billion ≈ $329.01 Million |
0.255x | +33.81% |
| 2021-12-31 | NT$41.68 Billion ≈ $1.31 Billion |
NT$7.95 Billion ≈ $250.61 Million |
0.191x | -0.95% |
| 2020-12-31 | NT$32.04 Billion ≈ $1.01 Billion |
NT$6.17 Billion ≈ $194.51 Million |
0.193x | -32.97% |
| 2019-12-31 | NT$29.69 Billion ≈ $935.45 Million |
NT$8.54 Billion ≈ $268.91 Million |
0.287x | +30.79% |
| 2018-12-31 | NT$27.87 Billion ≈ $878.14 Million |
NT$6.13 Billion ≈ $193.00 Million |
0.220x | +14.64% |
| 2017-12-31 | NT$25.34 Billion ≈ $798.41 Million |
NT$4.86 Billion ≈ $153.07 Million |
0.192x | +15.31% |
| 2016-12-31 | NT$24.48 Billion ≈ $771.18 Million |
NT$4.07 Billion ≈ $128.22 Million |
0.166x | -34.87% |
| 2015-12-31 | NT$24.24 Billion ≈ $763.80 Million |
NT$6.19 Billion ≈ $194.99 Million |
0.255x | +13.75% |
| 2014-12-31 | NT$23.96 Billion ≈ $754.98 Million |
NT$5.38 Billion ≈ $169.43 Million |
0.224x | -13.92% |
| 2013-12-31 | NT$22.64 Billion ≈ $713.35 Million |
NT$5.90 Billion ≈ $185.97 Million |
0.261x | +3.05% |
| 2012-12-31 | NT$18.13 Billion ≈ $571.07 Million |
NT$4.59 Billion ≈ $144.47 Million |
0.253x | -10.39% |
| 2011-12-31 | NT$16.78 Billion ≈ $528.59 Million |
NT$4.74 Billion ≈ $149.24 Million |
0.282x | +2.54% |
| 2010-12-31 | NT$15.66 Billion ≈ $493.46 Million |
NT$4.31 Billion ≈ $135.86 Million |
0.275x | -8.79% |
| 2009-12-31 | NT$6.16 Billion ≈ $194.11 Million |
NT$1.86 Billion ≈ $58.60 Million |
0.302x | -26.76% |
| 2008-12-31 | NT$5.56 Billion ≈ $175.07 Million |
NT$2.29 Billion ≈ $72.15 Million |
0.412x | +31.24% |
| 2007-12-31 | NT$6.34 Billion ≈ $199.86 Million |
NT$1.99 Billion ≈ $62.77 Million |
0.314x | +31.47% |
| 2006-12-31 | NT$5.37 Billion ≈ $169.17 Million |
NT$1.28 Billion ≈ $40.41 Million |
0.239x | -- |
About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more