Chipbond Technology (6147) - Cash Flow Conversion Efficiency

Latest as of December 2025: 0.042x

Based on the latest financial reports, Chipbond Technology (6147) has a cash flow conversion efficiency ratio of 0.042x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (NT$1.99 Billion ≈ $62.73 Million USD) by net assets (NT$47.37 Billion ≈ $1.49 Billion USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See Chipbond Technology balance sheet quality to measure how much of total assets are equity-financed.

Chipbond Technology - Cash Flow Conversion Efficiency Trend (2006–2025)

This chart illustrates how Chipbond Technology's cash flow conversion efficiency has evolved over time, based on yearly financial data. Check Chipbond Technology earnings quality ratio to evaluate the quality of earnings relative to operating cash generation.

Chipbond Technology Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Chipbond Technology ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Topco Scientific Co Ltd
TW:5434
0.035x
Sinopharm Group Co. Ltd
F:X2S
-0.020x
Green Brick Partners Inc
NYSE:GRBK
0.028x
Tofas Turk Otomobil Fabrikasi AS
IS:TOASO
-0.019x
Caida Securities Co Ltd
SHG:600906
0.210x
Vidrala SA
MC:VID
0.153x
Sinopec Shanghai Petrochemical Co Ltd Class A
SHG:600688
-0.027x
PENNON GROUP PLC UNS.ADR2
F:3PN0
N/A

Annual Cash Flow Conversion Efficiency for Chipbond Technology (2006–2025)

The table below shows the annual cash flow conversion efficiency of Chipbond Technology from 2006 to 2025. For the full company profile with market capitalisation and key ratios, see Chipbond Technology (6147) total market value.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2025-12-31 NT$47.37 Billion
≈ $1.49 Billion
NT$3.55 Billion
≈ $111.80 Million
0.075x -33.78%
2024-12-31 NT$47.13 Billion
≈ $1.48 Billion
NT$5.33 Billion
≈ $167.99 Million
0.113x -17.14%
2023-12-31 NT$48.48 Billion
≈ $1.53 Billion
NT$6.62 Billion
≈ $208.52 Million
0.137x -46.55%
2022-12-31 NT$40.89 Billion
≈ $1.29 Billion
NT$10.44 Billion
≈ $329.01 Million
0.255x +33.81%
2021-12-31 NT$41.68 Billion
≈ $1.31 Billion
NT$7.95 Billion
≈ $250.61 Million
0.191x -0.95%
2020-12-31 NT$32.04 Billion
≈ $1.01 Billion
NT$6.17 Billion
≈ $194.51 Million
0.193x -32.97%
2019-12-31 NT$29.69 Billion
≈ $935.45 Million
NT$8.54 Billion
≈ $268.91 Million
0.287x +30.79%
2018-12-31 NT$27.87 Billion
≈ $878.14 Million
NT$6.13 Billion
≈ $193.00 Million
0.220x +14.64%
2017-12-31 NT$25.34 Billion
≈ $798.41 Million
NT$4.86 Billion
≈ $153.07 Million
0.192x +15.31%
2016-12-31 NT$24.48 Billion
≈ $771.18 Million
NT$4.07 Billion
≈ $128.22 Million
0.166x -34.87%
2015-12-31 NT$24.24 Billion
≈ $763.80 Million
NT$6.19 Billion
≈ $194.99 Million
0.255x +13.75%
2014-12-31 NT$23.96 Billion
≈ $754.98 Million
NT$5.38 Billion
≈ $169.43 Million
0.224x -13.92%
2013-12-31 NT$22.64 Billion
≈ $713.35 Million
NT$5.90 Billion
≈ $185.97 Million
0.261x +3.05%
2012-12-31 NT$18.13 Billion
≈ $571.07 Million
NT$4.59 Billion
≈ $144.47 Million
0.253x -10.39%
2011-12-31 NT$16.78 Billion
≈ $528.59 Million
NT$4.74 Billion
≈ $149.24 Million
0.282x +2.54%
2010-12-31 NT$15.66 Billion
≈ $493.46 Million
NT$4.31 Billion
≈ $135.86 Million
0.275x -8.79%
2009-12-31 NT$6.16 Billion
≈ $194.11 Million
NT$1.86 Billion
≈ $58.60 Million
0.302x -26.76%
2008-12-31 NT$5.56 Billion
≈ $175.07 Million
NT$2.29 Billion
≈ $72.15 Million
0.412x +31.24%
2007-12-31 NT$6.34 Billion
≈ $199.86 Million
NT$1.99 Billion
≈ $62.77 Million
0.314x +31.47%
2006-12-31 NT$5.37 Billion
≈ $169.17 Million
NT$1.28 Billion
≈ $40.41 Million
0.239x --

About Chipbond Technology

TWO:6147 Taiwan Semiconductor Equipment & Materials
Market Cap
$3.05 Billion
NT$96.80 Billion TWD
Market Cap Rank
#4786 Global
#133 in Taiwan
Share Price
NT$130.00
Change (1 day)
+9.70%
52-Week Range
NT$51.20 - NT$305.50
All Time High
NT$305.50
About

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more