Chipbond Technology Market Cap ($4.60 Billion)
Market Cap & Net Worth: Chipbond Technology (6147)
Chipbond Technology market cap. Chipbond Technology (TWO:6147) has a market capitalization of $4.60 Billion (NT$145.94 Billion) as of October 31, 2026. Listed on the TWO stock exchange, this Taiwan-based company holds position #3634 globally and #111 in its home market, demonstrating a -8.20% decrease in market value over the past year.
Market capitalization, also known as net worth in stock markets, is calculated by multiplying Chipbond Technology's stock price NT$196.00 by its total outstanding shares 744593539 (744.59 Million).
Chipbond Technology Market Cap History (2015–2026)
Chipbond Technology market cap history from 2015 to 2026. Data shows growth from $868.29 Million to $4.60 Billion (16.17% CAGR). Check Chipbond Technology (6147) share price today for real-time trading data and today's change.
Chipbond Technology Market Cap to Earnings & Revenue Ratios Timeline
This chart shows how Chipbond Technology's valuation ratios have evolved. The Price to Sales (P/S) ratio compares market cap to revenue, while the Price to Earnings (P/E) ratio compares market cap to net income. Lower values may indicate a more undervalued company relative to its financial performance. Also see cash efficiency ratio of Chipbond Technology for how efficiently the company converts equity into cash flow.
Latest Price to Sales (P/S) Ratio
0.06x
Chipbond Technology's market cap is 0.06 times its annual revenue
Latest Price to Earnings (P/E) Ratio
0.46x
Chipbond Technology's market cap is 0.46 times its annual earnings
What These Ratios Tell Investors:
- Price to Sales (P/S) Ratio: Shows how much investors are paying for each dollar of the company's sales. Lower P/S ratios may indicate undervaluation.
- Price to Earnings (P/E) Ratio: Shows how much investors are paying for each dollar of the company's earnings. This is one of the most common valuation metrics.
- Trends in these ratios over time can indicate changing investor sentiment about the company's future growth prospects.
- Industry comparison provides context for whether the company is valued higher or lower than peers.
| Year | Market Cap (USD) | Revenue (USD) | Net Income (USD) | P/S Ratio | P/E Ratio |
|---|---|---|---|---|---|
| 2016 | $884.08 Million | $17.26 Billion | $1.99 Billion | 0.05x | 0.44x |
| 2017 | $1.13 Billion | $18.43 Billion | $2.25 Billion | 0.06x | 0.50x |
| 2018 | $1.29 Billion | $18.73 Billion | $4.51 Billion | 0.07x | 0.29x |
| 2019 | $1.48 Billion | $20.42 Billion | $4.09 Billion | 0.07x | 0.36x |
| 2020 | $1.56 Billion | $22.28 Billion | $3.66 Billion | 0.07x | 0.43x |
| 2021 | $1.56 Billion | $27.08 Billion | $6.14 Billion | 0.06x | 0.25x |
| 2022 | $1.35 Billion | $24.01 Billion | $6.21 Billion | 0.06x | 0.22x |
| 2023 | $1.70 Billion | $20.06 Billion | $3.99 Billion | 0.08x | 0.42x |
| 2024 | $1.51 Billion | $20.34 Billion | $4.13 Billion | 0.07x | 0.37x |
| 2025 | $1.26 Billion | $21.45 Billion | $2.78 Billion | 0.06x | 0.46x |
Competitor Companies of 6147 by Market Capitalization
Companies near Chipbond Technology in the global market cap rankings as of October 31, 2026. See net asset quality index of Chipbond Technology to understand what proportion of total assets are financed by equity.
Key companies related to Chipbond Technology by market ranking:
- ASML Holding N.V. (AS:ASML): Ranked #28 globally with a market cap of $618.17 Billion USD ( €528.76 Billion EUR).
- ASML Holding NV ADR (NASDAQ:ASML): Ranked #31 globally with a market cap of $546.45 Billion USD.
- ASML HOLDING NY EO-09 (F:ASMF): Ranked #32 globally with a market cap of $520.31 Billion USD ( €445.05 Billion EUR).
- Applied Materials Inc (NASDAQ:AMAT): Ranked #55 globally with a market cap of $309.57 Billion USD.
| Rank | Company | Symbol | Market Cap | Price |
|---|---|---|---|---|
| #28 | ASML Holding N.V. | AS:ASML | $618.17 Billion | €1412.80 |
| #31 | ASML Holding NV ADR | NASDAQ:ASML | $546.45 Billion | $1417.80 |
| #32 | ASML HOLDING NY EO-09 | F:ASMF | $520.31 Billion | €1410.00 |
| #55 | Applied Materials Inc | NASDAQ:AMAT | $309.57 Billion | $390.09 |
Market Capitalization of Chipbond Technology (2015–2026)
Market capitalization of Chipbond Technology from 2015 to today. Between 2015 and today, Chipbond Technology's market cap moved from $868.29 Million to $ 4.60 Billion, with a yearly change of 16.17%.
| Year | Market Cap | Change (%) |
|---|---|---|
| 2026 | NT$4.60 Billion | +263.64% |
| 2025 | NT$1.26 Billion | -16.30% |
| 2024 | NT$1.51 Billion | -10.93% |
| 2023 | NT$1.70 Billion | +25.96% |
| 2022 | NT$1.35 Billion | -13.94% |
| 2021 | NT$1.56 Billion | +0.45% |
| 2020 | NT$1.56 Billion | +5.59% |
| 2019 | NT$1.48 Billion | +14.33% |
| 2018 | NT$1.29 Billion | +13.99% |
| 2017 | NT$1.13 Billion | +28.03% |
| 2016 | NT$884.08 Million | +1.82% |
| 2015 | NT$868.29 Million | -- |
End of Day Market Cap According to Different Sources
On Oct 31st, 2026 the market cap of Chipbond Technology was reported to be:
| Source | Market Cap |
|---|---|
| Yahoo Finance | $4.60 Billion USD |
| MoneyControl | $4.60 Billion USD |
| MarketWatch | $4.60 Billion USD |
| marketcap.company | $4.60 Billion USD |
| Reuters | $4.60 Billion USD |
Market cap values may vary slightly between sources due to differences in calculation methods, timing, and data refresh rates.
About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more