Chipbond Technology Total Liabilities
Chipbond Technology total liabilities. Based on the latest financial reports, Chipbond Technology (6147) has total liabilities worth NT$8.60 Billion TWD (≈ $271.09 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Chipbond Technology (6147) liquid assets ratio to evaluate the company's liquid asset resilience ratio.
Total Liabilities of Chipbond Technology (2006–2025)
Total liabilities of Chipbond Technology from 2006 to 2025. This chart illustrates how Chipbond Technology's total liabilities have evolved over time, based on quarterly financial data.
Chipbond Technology Competitors by Total Liabilities
The table below lists competitors of Chipbond Technology ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Dianthus Therapeutics Inc.
NASDAQ:DNTH
|
USA | $41.25 Million |
|
TFS Financial Corporation
NASDAQ:TFSL
|
USA | $16.12 Billion |
|
COSCO SHIPPING Specialized Carriers Co Ltd
SHG:600428
|
China | CN¥26.32 Billion |
|
AUTO1 Group SE
F:AG1
|
Germany | €2.08 Billion |
|
Perimeter Solutions SA
NYSE:PRM
|
USA | $2.22 Billion |
|
GEM CO. LTD SP.GDR/10 A
F:3730
|
Germany | €48.41 Billion |
|
Grupo Financiero Galicia S.A
F:GF4
|
Germany | €36.57 Trillion |
|
Lifestance Health Group Inc
NASDAQ:LFST
|
USA | $704.35 Million |
Liability Composition Analysis (2006–2025)
This chart breaks down Chipbond Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Chipbond Technology asset portfolio.
Liquidity & Leverage Metrics
Chipbond Technology Total Liabilities Ratios Explained
Chipbond Technology total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.44 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.18 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.16 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Chipbond Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Chipbond Technology (2006–2025)
The table below shows the annual total liabilities of Chipbond Technology from 2006 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$6.86 Billion ≈ $216.19 Million |
+40.33% |
| 2024-12-31 | NT$4.89 Billion ≈ $154.06 Million |
-19.13% |
| 2023-12-31 | NT$6.05 Billion ≈ $190.49 Million |
-39.94% |
| 2022-12-31 | NT$10.07 Billion ≈ $317.15 Million |
-16.97% |
| 2021-12-31 | NT$12.12 Billion ≈ $381.99 Million |
+7.97% |
| 2020-12-31 | NT$11.23 Billion ≈ $353.78 Million |
+6.67% |
| 2019-12-31 | NT$10.53 Billion ≈ $331.66 Million |
-10.30% |
| 2018-12-31 | NT$11.74 Billion ≈ $369.76 Million |
+16.68% |
| 2017-12-31 | NT$10.06 Billion ≈ $316.90 Million |
+1.87% |
| 2016-12-31 | NT$9.87 Billion ≈ $311.07 Million |
-30.64% |
| 2015-12-31 | NT$14.24 Billion ≈ $448.51 Million |
-11.74% |
| 2014-12-31 | NT$16.13 Billion ≈ $508.16 Million |
+3.48% |
| 2013-12-31 | NT$15.59 Billion ≈ $491.09 Million |
+66.52% |
| 2012-12-31 | NT$9.36 Billion ≈ $294.91 Million |
-3.34% |
| 2011-12-31 | NT$9.68 Billion ≈ $305.11 Million |
+40.17% |
| 2010-12-31 | NT$6.91 Billion ≈ $217.68 Million |
+43.67% |
| 2009-12-31 | NT$4.81 Billion ≈ $151.52 Million |
-7.11% |
| 2008-12-31 | NT$5.18 Billion ≈ $163.11 Million |
-9.07% |
| 2007-12-31 | NT$5.69 Billion ≈ $179.38 Million |
+59.96% |
| 2006-12-31 | NT$3.56 Billion ≈ $112.14 Million |
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About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more