Chipbond Technology (6147) - Total Liabilities
Based on the latest financial reports, Chipbond Technology (6147) has total liabilities worth NT$8.60 Billion TWD (≈ $271.09 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Chipbond Technology liquidity resilience to evaluate the company's liquid asset resilience ratio.
Chipbond Technology - Total Liabilities Trend (2006–2025)
This chart illustrates how Chipbond Technology's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see Chipbond Technology (6147) total assets.
Chipbond Technology Competitors by Total Liabilities
The table below lists competitors of Chipbond Technology ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Garrett Motion Inc
NASDAQ:GTX
|
USA | $3.15 Billion |
|
PERSIMMON UNSPON. ADR 2
F:OHP0
|
Germany | €1.86 Billion |
|
Chewy Inc
NYSE:CHWY
|
USA | $2.88 Billion |
|
Investec PLC
JSE:INP
|
South Africa | ZAC26.62 Billion |
|
DELEK GP SP.ADR/1/01/O.N
F:6D40
|
Germany | €40.73 Billion |
|
TAL Education Group
NYSE:TAL
|
USA | $2.69 Billion |
|
CSW Industrials, Inc.
NASDAQ:CSW
|
USA | $369.40 Million |
|
Virtu Financial, Inc.
NYSE:VIRT
|
USA | $18.18 Billion |
Liability Composition Analysis (2006–2025)
This chart breaks down Chipbond Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Chipbond Technology balance sheet independence to measure how much of total assets are equity-financed.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.44 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.18 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.16 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Chipbond Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Chipbond Technology (2006–2025)
The table below shows the annual total liabilities of Chipbond Technology from 2006 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$6.86 Billion ≈ $216.19 Million |
+40.33% |
| 2024-12-31 | NT$4.89 Billion ≈ $154.06 Million |
-19.13% |
| 2023-12-31 | NT$6.05 Billion ≈ $190.49 Million |
-39.94% |
| 2022-12-31 | NT$10.07 Billion ≈ $317.15 Million |
-16.97% |
| 2021-12-31 | NT$12.12 Billion ≈ $381.99 Million |
+7.97% |
| 2020-12-31 | NT$11.23 Billion ≈ $353.78 Million |
+6.67% |
| 2019-12-31 | NT$10.53 Billion ≈ $331.66 Million |
-10.30% |
| 2018-12-31 | NT$11.74 Billion ≈ $369.76 Million |
+16.68% |
| 2017-12-31 | NT$10.06 Billion ≈ $316.90 Million |
+1.87% |
| 2016-12-31 | NT$9.87 Billion ≈ $311.07 Million |
-30.64% |
| 2015-12-31 | NT$14.24 Billion ≈ $448.51 Million |
-11.74% |
| 2014-12-31 | NT$16.13 Billion ≈ $508.16 Million |
+3.48% |
| 2013-12-31 | NT$15.59 Billion ≈ $491.09 Million |
+66.52% |
| 2012-12-31 | NT$9.36 Billion ≈ $294.91 Million |
-3.34% |
| 2011-12-31 | NT$9.68 Billion ≈ $305.11 Million |
+40.17% |
| 2010-12-31 | NT$6.91 Billion ≈ $217.68 Million |
+43.67% |
| 2009-12-31 | NT$4.81 Billion ≈ $151.52 Million |
-7.11% |
| 2008-12-31 | NT$5.18 Billion ≈ $163.11 Million |
-9.07% |
| 2007-12-31 | NT$5.69 Billion ≈ $179.38 Million |
+59.96% |
| 2006-12-31 | NT$3.56 Billion ≈ $112.14 Million |
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About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer s… Read more