TSE Co. Ltd (131290) - Total Liabilities
Based on the latest financial reports, TSE Co. Ltd (131290) has total liabilities worth ₩127.00 Billion KRW (≈ $86.07 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore TSE Co. Ltd operating cash flow efficiency to assess how effectively this company generates cash.
TSE Co. Ltd - Total Liabilities Trend (2010–2024)
This chart illustrates how TSE Co. Ltd's total liabilities have evolved over time, based on quarterly financial data. Check 131290 asset resilience ratio to evaluate the company's liquid asset resilience ratio.
TSE Co. Ltd Competitors by Total Liabilities
The table below lists competitors of TSE Co. Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Jiangsu Changhai Compos Material
SHE:300196
|
China | CN¥2.60 Billion |
|
Genting Plantations Bhd
KLSE:2291
|
Malaysia | RM3.99 Billion |
|
Shanghai Xinpeng Industry Co Ltd
SHE:002328
|
China | CN¥1.82 Billion |
|
Growthpoint Properties Australia
AU:GOZ
|
Australia | AU$1.99 Billion |
|
Opera Limited
F:2V8
|
Germany | €132.53 Million |
|
Lindsay Corporation
NYSE:LNN
|
USA | $310.24 Million |
|
Shanghai Tongji Science&Technology Industrial Co Ltd
SHG:600846
|
China | CN¥9.33 Billion |
|
Trinity Capital Inc
NASDAQ:TRIN
|
USA | $1.25 Billion |
Liability Composition Analysis (2010–2024)
This chart breaks down TSE Co. Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see TSE Co. Ltd (131290) market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.67 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.36 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.24 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how TSE Co. Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for TSE Co. Ltd (2010–2024)
The table below shows the annual total liabilities of TSE Co. Ltd from 2010 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | ₩119.71 Billion ≈ $81.13 Million |
+25.62% |
| 2023-12-31 | ₩95.30 Billion ≈ $64.58 Million |
-34.72% |
| 2022-12-31 | ₩145.98 Billion ≈ $98.93 Million |
+10.81% |
| 2021-12-31 | ₩131.74 Billion ≈ $89.28 Million |
+24.31% |
| 2020-12-31 | ₩105.97 Billion ≈ $71.82 Million |
+6.82% |
| 2019-12-31 | ₩99.21 Billion ≈ $67.23 Million |
+22.73% |
| 2018-12-31 | ₩80.83 Billion ≈ $54.78 Million |
+11.22% |
| 2017-12-31 | ₩72.68 Billion ≈ $49.25 Million |
+3.17% |
| 2016-12-31 | ₩70.44 Billion ≈ $47.74 Million |
+14.88% |
| 2015-12-31 | ₩61.32 Billion ≈ $41.56 Million |
+31.39% |
| 2014-12-31 | ₩46.67 Billion ≈ $31.63 Million |
+2.07% |
| 2013-12-31 | ₩45.72 Billion ≈ $30.99 Million |
+10.15% |
| 2012-12-31 | ₩41.51 Billion ≈ $28.13 Million |
-14.90% |
| 2011-12-31 | ₩48.78 Billion ≈ $33.06 Million |
+77.29% |
| 2010-12-31 | ₩27.51 Billion ≈ $18.65 Million |
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About TSE Co. Ltd
TSE Co., Ltd provides semiconductor test solutions in South Korea and internationally. The company offers probe cards, including high performance and vertical mems probe cards, and OLED fixel test solutions; standard interface solutions, such as high speed and high parallelism interface solutions; and tester on-board interface products, including BOST, CFDS, and power boost interface solutions. I… Read more