Chipbond Technology (6147) - Total Liabilities

Latest total liabilities as of December 2025: NT$6.86 Billion TWD

Based on the latest financial reports, Chipbond Technology (6147) has total liabilities worth NT$6.86 Billion TWD as of December 2025.

Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Chipbond Technology - Total Liabilities Trend (2006–2025)

This chart illustrates how Chipbond Technology's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.

Chipbond Technology Competitors by Total Liabilities

The table below lists competitors of Chipbond Technology ranked by their total liabilities.

Liability Composition Analysis (2006–2025)

This chart breaks down Chipbond Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.

Liquidity & Leverage Metrics

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Chipbond Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Chipbond Technology (2006–2025)

The table below shows the annual total liabilities of Chipbond Technology from 2006 to 2025.