Shenmao Technology Inc (3305) - Cash Flow Conversion Efficiency

Latest as of December 2025: -0.048x

Based on the latest financial reports, Shenmao Technology Inc (3305) has a cash flow conversion efficiency ratio of -0.048x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (NT$-273.34 Million ≈ $-8.61 Million USD) by net assets (NT$5.69 Billion ≈ $179.27 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See 3305 cash and liquid assets coverage to measure how many days the company can operate on defensive assets alone.

Shenmao Technology Inc - Cash Flow Conversion Efficiency Trend (2008–2025)

This chart illustrates how Shenmao Technology Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data.

Shenmao Technology Inc Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Shenmao Technology Inc ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Z Squared Inc.
NASDAQ:ZSQR
-0.095x
Chahua Modern Housewares Co Ltd
SHG:603615
-0.105x
Viaplay Group AB (publ)
ST:VPLAY-B
0.037x
Chengdu B-ray Media Co Ltd
SHG:600880
-0.001x
Fundamenta Real Estate AG
SW:FREN
0.017x
Rosenbauer International AG
VI:ROS
-0.110x
EverQuote Inc Class A
NASDAQ:EVER
0.123x
Tatwah Smartech Co Ltd
SHE:002512
0.085x

Annual Cash Flow Conversion Efficiency for Shenmao Technology Inc (2008–2025)

The table below shows the annual cash flow conversion efficiency of Shenmao Technology Inc from 2008 to 2025. For the full company profile with market capitalisation and key ratios, see 3305 market cap.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2025-12-31 NT$5.69 Billion
≈ $179.27 Million
NT$-976.24 Million
≈ $-30.76 Million
-0.172x +9.51%
2024-12-31 NT$4.98 Billion
≈ $156.94 Million
NT$-944.45 Million
≈ $-29.76 Million
-0.190x -226.14%
2023-12-31 NT$4.73 Billion
≈ $149.15 Million
NT$711.60 Million
≈ $22.42 Million
0.150x -51.90%
2022-12-31 NT$4.72 Billion
≈ $148.73 Million
NT$1.48 Billion
≈ $46.48 Million
0.313x +290.06%
2021-12-31 NT$4.44 Billion
≈ $139.88 Million
NT$-730.03 Million
≈ $-23.00 Million
-0.164x -765.03%
2020-12-31 NT$3.67 Billion
≈ $115.67 Million
NT$-69.78 Million
≈ $-2.20 Million
-0.019x -118.51%
2019-12-31 NT$3.56 Billion
≈ $112.28 Million
NT$365.89 Million
≈ $11.53 Million
0.103x +9.47%
2018-12-31 NT$3.64 Billion
≈ $114.73 Million
NT$341.53 Million
≈ $10.76 Million
0.094x +628.68%
2017-12-31 NT$3.75 Billion
≈ $118.22 Million
NT$-66.57 Million
≈ $-2.10 Million
-0.018x +81.28%
2016-12-31 NT$3.96 Billion
≈ $124.67 Million
NT$-374.94 Million
≈ $-11.81 Million
-0.095x -148.34%
2015-12-31 NT$4.02 Billion
≈ $126.74 Million
NT$788.56 Million
≈ $24.84 Million
0.196x +180.34%
2014-12-31 NT$4.25 Billion
≈ $133.80 Million
NT$296.95 Million
≈ $9.36 Million
0.070x -68.14%
2013-12-31 NT$3.89 Billion
≈ $122.55 Million
NT$853.76 Million
≈ $26.90 Million
0.219x -34.48%
2012-12-31 NT$3.67 Billion
≈ $115.59 Million
NT$1.23 Billion
≈ $38.72 Million
0.335x +80.04%
2011-12-31 NT$3.73 Billion
≈ $117.45 Million
NT$693.63 Million
≈ $21.85 Million
0.186x +182.39%
2010-12-31 NT$3.02 Billion
≈ $95.06 Million
NT$-681.40 Million
≈ $-21.47 Million
-0.226x -324.06%
2009-12-31 NT$2.92 Billion
≈ $91.87 Million
NT$293.93 Million
≈ $9.26 Million
0.101x -77.77%
2008-12-31 NT$2.03 Billion
≈ $63.95 Million
NT$920.50 Million
≈ $29.00 Million
0.454x --

About Shenmao Technology Inc

TW:3305 Taiwan Electronic Components
Market Cap
$641.09 Million
NT$20.35 Billion TWD
Market Cap Rank
#11162 Global
#412 in Taiwan
Share Price
NT$146.00
Change (1 day)
+2.46%
52-Week Range
NT$55.50 - NT$167.50
All Time High
NT$167.50
About

Shenmao Technology Inc, together with its subsidiaries, manufactures and sells solder materials in the Taiwan, Mainland China, Thailand, Malaysia, and internationally. The company offers SMT assembly materials, including tin lead, lead-free, water soluble, package on package, low temperature, and halogen free solder pastes, as well as adhesives; and semiconductor packaging products, such as BGA s… Read more