ChipMOS Technologies (8150) - Total Assets
Based on the latest financial reports, ChipMOS Technologies (8150) holds total assets worth NT$44.83 Billion TWD (≈ $1.41 Billion USD) as of March 2026. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. Explore debt repayment capacity of ChipMOS Technologies to assess how comfortably operating cash covers total debt obligations.
ChipMOS Technologies - Total Assets Trend (2005–2025)
This chart illustrates how ChipMOS Technologies's total assets have evolved over time, based on quarterly financial data. See ChipMOS Technologies shareholders equity for net asset value and shareholders' equity analysis.
ChipMOS Technologies - Asset Composition Analysis
Current Asset Composition (December 2025)
ChipMOS Technologies's total assets of NT$44.83 Billion consist of 55.5% current assets and 44.6% non-current assets.
| Asset Category | Amount (TWD) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 32.8% |
| Accounts Receivable | NT$6.68 Billion | 14.7% |
| Inventory | NT$3.36 Billion | 7.4% |
| Property, Plant & Equipment | NT$0.00 | 0.0% |
| Intangible Assets | NT$0.00 | 0.0% |
| Goodwill | NT$0.00 | 0.0% |
Asset Composition Trend (2005–2025)
This chart illustrates how ChipMOS Technologies's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see market cap of ChipMOS Technologies.
Key Asset Composition Facts
- Current vs. Non-Current Assets: ChipMOS Technologies's current assets represent 55.5% of total assets in 2025, an increase from 0.0% in 2005.
- Cash Position: Cash and equivalents constituted 32.8% of total assets in 2025, up from 11.2% in 2005.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 0.0% of total assets, unchanged from 0.0% in 2005.
- Asset Diversification: The largest asset category is accounts receivable at 14.7% of total assets.
ChipMOS Technologies Competitors by Total Assets
Key competitors of ChipMOS Technologies based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
GlobalWafers Co Ltd
TWO:6488
|
Taiwan | NT$218.34 Billion |
|
Amlogic Shanghai Co Ltd
SHG:688099
|
China | CN¥8.35 Billion |
|
Nexchip Semiconductor Corp. A
SHG:688249
|
China | CN¥51.21 Billion |
|
Union Semiconductor (Hefei) Co. Ltd. A
SHG:688403
|
China | CN¥5.05 Billion |
|
Melexis NV
BR:MELE
|
Belgium | €903.27 Million |
|
Goke Microelectronics Co Ltd
SHE:300672
|
China | CN¥6.94 Billion |
|
Bestechnic (Shanghai) Co. Ltd. A
SHG:688608
|
China | CN¥7.49 Billion |
|
Nations Technologies Inc
SHE:300077
|
China | CN¥3.57 Billion |
ChipMOS Technologies - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 2.44 | 3.12 | 2.21 |
| Quick Ratio | 1.98 | 2.74 | 1.83 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | NT$14.35 Billion | NT$15.11 Billion | NT$8.05 Billion |
ChipMOS Technologies - Advanced Valuation Insights
This section examines the relationship between ChipMOS Technologies's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 2.71 |
| Latest Market Cap to Assets Ratio | 0.04 |
| Asset Growth Rate (YoY) | -0.1% |
| Total Assets | NT$45.35 Billion |
| Market Capitalization | $1.59 Billion USD |
Valuation Analysis
Below Book Valuation: The market values ChipMOS Technologies's assets below their book value (0.04x), which may indicate investor concerns about asset quality or future growth.
Slight Asset Contraction: ChipMOS Technologies's assets decreased by 0.1% over the past year, which may reflect streamlining or optimization of resources.
Annual Total Assets for ChipMOS Technologies (2005–2025)
The table below shows the annual total assets of ChipMOS Technologies from 2005 to 2025.
| Year | Total Assets | Change |
|---|---|---|
| 2025-12-31 | NT$45.35 Billion ≈ $1.43 Billion |
-0.06% |
| 2024-12-31 | NT$45.38 Billion ≈ $1.43 Billion |
-1.69% |
| 2023-12-31 | NT$46.16 Billion ≈ $1.45 Billion |
+2.71% |
| 2022-12-31 | NT$44.94 Billion ≈ $1.42 Billion |
+5.69% |
| 2021-12-31 | NT$42.52 Billion ≈ $1.34 Billion |
+21.21% |
| 2020-12-31 | NT$35.08 Billion ≈ $1.11 Billion |
+2.26% |
| 2019-12-31 | NT$34.31 Billion ≈ $1.08 Billion |
+3.54% |
| 2018-12-31 | NT$33.13 Billion ≈ $1.04 Billion |
-0.38% |
| 2017-12-31 | NT$33.26 Billion ≈ $1.05 Billion |
+6.28% |
| 2016-12-31 | NT$31.30 Billion ≈ $985.99 Million |
+1.20% |
| 2015-12-31 | NT$30.93 Billion ≈ $974.32 Million |
-10.71% |
| 2014-12-31 | NT$34.64 Billion ≈ $1.09 Billion |
+15.26% |
| 2013-12-31 | NT$30.05 Billion ≈ $946.70 Million |
+2.68% |
| 2012-12-31 | NT$29.27 Billion ≈ $922.04 Million |
+4.40% |
| 2011-12-31 | NT$28.03 Billion ≈ $883.16 Million |
-9.60% |
| 2010-12-31 | NT$31.01 Billion ≈ $976.92 Million |
+5.99% |
| 2009-12-31 | NT$29.26 Billion ≈ $921.70 Million |
-10.44% |
| 2008-12-31 | NT$32.67 Billion ≈ $1.03 Billion |
-17.25% |
| 2007-12-31 | NT$39.47 Billion ≈ $1.24 Billion |
+2.17% |
| 2006-12-31 | NT$38.64 Billion ≈ $1.22 Billion |
+37.52% |
| 2005-12-31 | NT$28.09 Billion ≈ $885.13 Million |
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About ChipMOS Technologies
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packag… Read more