Kinsus Interconnect Technology Corp Asset Resilience Ratio
Kinsus Interconnect Technology Corp asset resilience ratio. Kinsus Interconnect Technology Corp (3189) has an Asset Resilience Ratio of 10.16% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read 3189 liabilities breakdown for a breakdown of total debt and financial obligations.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio of Kinsus Interconnect Technology Corp (2002–2025)
Asset resilience ratio of Kinsus Interconnect Technology Corp from 2002 to 2025. This chart shows how Kinsus Interconnect Technology Corp's Asset Resilience Ratio has changed over time. See Kinsus Interconnect Technology Corp (3189) free cash flow to measure how efficiently the company converts operating cash flow to free cash.
Liquid Assets Composition Over Time
This chart breaks down Kinsus Interconnect Technology Corp's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see 3189 current and non-current assets.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$8.50 Billion | 10.16% |
| Total Liquid Assets | NT$8.50 Billion | 10.16% |
Asset Resilience Insights
- Moderate Liquidity: Kinsus Interconnect Technology Corp has 10.16% of assets in liquid form.
- While adequate for normal operations, this level may limit flexibility during economic stress.
- The company has significant short-term investments, indicating active treasury management.
Kinsus Interconnect Technology Corp Industry Peers by Asset Resilience Ratio
Compare Kinsus Interconnect Technology Corp's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Formosa Sumco Technology Corp
TW:3532 |
Semiconductor Equipment & Materials | -0.08% |
|
Suzhou Everbright Photonics Co. Ltd. A
SHG:688048 |
Semiconductor Equipment & Materials | 15.57% |
|
Elite Advanced Laser Corp
TW:3450 |
Semiconductor Equipment & Materials | 9.75% |
|
KNJ Co. Ltd
KQ:272110 |
Semiconductor Equipment & Materials | 9.18% |
|
Bluglass Ltd
AU:BLG |
Semiconductor Equipment & Materials | 23.98% |
|
Spectra7 Microsystems Inc
V:SEV |
Semiconductor Equipment & Materials | 29.72% |
|
NAURA Technology Group Co Ltd
SHE:002371 |
Semiconductor Equipment & Materials | 0.04% |
|
Advanced Micro Fabrication Inc
SHG:688012 |
Semiconductor Equipment & Materials | 2.66% |
Kinsus Interconnect Technology Corp Asset Resilience Ratio by Year (2002–2025)
Kinsus Interconnect Technology Corp asset resilience ratio by year from 2002 to 2025. The table below shows the annual Asset Resilience Ratio data for Kinsus Interconnect Technology Corp.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 5.07% | NT$4.05 Billion ≈ $127.74 Million |
NT$79.97 Billion ≈ $2.52 Billion |
+2.20pp |
| 2024-12-31 | 2.87% | NT$2.28 Billion ≈ $71.72 Million |
NT$79.44 Billion ≈ $2.50 Billion |
-3.94pp |
| 2023-12-31 | 6.81% | NT$5.31 Billion ≈ $167.38 Million |
NT$78.07 Billion ≈ $2.46 Billion |
+5.10pp |
| 2022-12-31 | 1.71% | NT$1.24 Billion ≈ $39.02 Million |
NT$72.63 Billion ≈ $2.29 Billion |
+0.62pp |
| 2021-12-31 | 1.09% | NT$636.14 Million ≈ $20.04 Million |
NT$58.39 Billion ≈ $1.84 Billion |
+0.10pp |
| 2020-12-31 | 0.99% | NT$423.06 Million ≈ $13.33 Million |
NT$42.78 Billion ≈ $1.35 Billion |
-3.24pp |
| 2019-12-31 | 4.22% | NT$1.76 Billion ≈ $55.51 Million |
NT$41.70 Billion ≈ $1.31 Billion |
+0.67pp |
| 2018-12-31 | 3.56% | NT$1.52 Billion ≈ $47.74 Million |
NT$42.62 Billion ≈ $1.34 Billion |
-1.12pp |
| 2017-12-31 | 4.68% | NT$1.98 Billion ≈ $62.28 Million |
NT$42.28 Billion ≈ $1.33 Billion |
-4.27pp |
| 2016-12-31 | 8.95% | NT$3.69 Billion ≈ $116.30 Million |
NT$41.25 Billion ≈ $1.30 Billion |
-0.35pp |
| 2015-12-31 | 9.30% | NT$3.96 Billion ≈ $124.90 Million |
NT$42.64 Billion ≈ $1.34 Billion |
-4.44pp |
| 2014-12-31 | 13.74% | NT$5.64 Billion ≈ $177.68 Million |
NT$41.05 Billion ≈ $1.29 Billion |
-1.22pp |
| 2013-12-31 | 14.96% | NT$5.70 Billion ≈ $179.59 Million |
NT$38.11 Billion ≈ $1.20 Billion |
+1.42pp |
| 2012-12-31 | 13.54% | NT$4.90 Billion ≈ $154.35 Million |
NT$36.19 Billion ≈ $1.14 Billion |
+1.60pp |
| 2011-12-31 | 11.93% | NT$4.21 Billion ≈ $132.64 Million |
NT$35.28 Billion ≈ $1.11 Billion |
+0.78pp |
| 2010-12-31 | 11.15% | NT$3.40 Billion ≈ $106.98 Million |
NT$30.44 Billion ≈ $959.10 Million |
-5.07pp |
| 2009-12-31 | 16.22% | NT$3.63 Billion ≈ $114.32 Million |
NT$22.37 Billion ≈ $704.72 Million |
+8.34pp |
| 2008-12-31 | 7.89% | NT$1.58 Billion ≈ $49.74 Million |
NT$20.02 Billion ≈ $630.80 Million |
-1.00pp |
| 2007-12-31 | 8.88% | NT$1.79 Billion ≈ $56.46 Million |
NT$20.17 Billion ≈ $635.50 Million |
+1.54pp |
| 2006-12-31 | 7.35% | NT$1.30 Billion ≈ $40.92 Million |
NT$17.67 Billion ≈ $556.77 Million |
-5.33pp |
| 2005-12-31 | 12.68% | NT$1.22 Billion ≈ $38.41 Million |
NT$9.61 Billion ≈ $302.89 Million |
+9.73pp |
| 2004-12-31 | 2.95% | NT$158.47 Million ≈ $4.99 Million |
NT$5.37 Billion ≈ $169.07 Million |
-1.63pp |
| 2003-12-31 | 4.58% | NT$166.41 Million ≈ $5.24 Million |
NT$3.63 Billion ≈ $114.41 Million |
-3.99pp |
| 2002-12-31 | 8.57% | NT$226.70 Million ≈ $7.14 Million |
NT$2.64 Billion ≈ $83.29 Million |
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About Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, mul… Read more