HANA Micron Inc (067310) - Cash Flow Conversion Efficiency

Latest as of September 2025: -0.039x

Based on the latest financial reports, HANA Micron Inc (067310) has a cash flow conversion efficiency ratio of -0.039x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩-24.09 Billion ≈ $-16.33 Million USD) by net assets (₩613.46 Billion ≈ $415.74 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. Also see 067310 company net worth for the company's overall valuation and market capitalisation.

HANA Micron Inc - Cash Flow Conversion Efficiency Trend (2008–2024)

This chart illustrates how HANA Micron Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data.

HANA Micron Inc Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of HANA Micron Inc ranked by their cash flow conversion efficiency. Explore 067310 cash flow quality score to measure how well operating cash flow supports reported net income.

Company Cash Flow Conversion Efficiency
China Building Material
SHG:603060
0.043x
Wuhan Sanzhen Industry Holding Co Ltd
SHG:600168
0.023x
MN Holdings Berhad
KLSE:0245
-0.055x
SEC Electric Mach Co Ltd
SHG:603988
0.015x
Lotte Tour Dev
KO:032350
-0.024x
Turaco Gold Ltd
AU:TCG
-0.146x
Hudson Pacific Properties Inc
NYSE:HPP
0.010x
Giti Tire Corp
SHG:600182
0.076x

Annual Cash Flow Conversion Efficiency for HANA Micron Inc (2008–2024)

The table below shows the annual cash flow conversion efficiency of HANA Micron Inc from 2008 to 2024. View today's stock price for HANA Micron Inc for real-time trading data and today's change.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2024-12-31 ₩605.83 Billion
≈ $410.56 Million
₩40.97 Billion
≈ $27.77 Million
0.068x -55.70%
2023-12-31 ₩544.39 Billion
≈ $368.92 Million
₩83.12 Billion
≈ $56.33 Million
0.153x -68.97%
2022-12-31 ₩264.11 Billion
≈ $178.98 Million
₩129.96 Billion
≈ $88.07 Million
0.492x -9.37%
2021-12-31 ₩274.87 Billion
≈ $186.28 Million
₩149.23 Billion
≈ $101.13 Million
0.543x -9.57%
2020-12-31 ₩137.89 Billion
≈ $93.45 Million
₩82.78 Billion
≈ $56.10 Million
0.600x +21.01%
2019-12-31 ₩144.96 Billion
≈ $98.24 Million
₩71.92 Billion
≈ $48.74 Million
0.496x +47.99%
2018-12-31 ₩133.94 Billion
≈ $90.77 Million
₩44.90 Billion
≈ $30.43 Million
0.335x +14.89%
2017-12-31 ₩131.69 Billion
≈ $89.25 Million
₩38.43 Billion
≈ $26.04 Million
0.292x +6.68%
2016-12-31 ₩120.63 Billion
≈ $81.75 Million
₩32.99 Billion
≈ $22.36 Million
0.274x +179.00%
2015-12-31 ₩137.54 Billion
≈ $93.21 Million
₩13.48 Billion
≈ $9.14 Million
0.098x -71.35%
2014-12-31 ₩139.75 Billion
≈ $94.70 Million
₩47.81 Billion
≈ $32.40 Million
0.342x +542.99%
2013-12-31 ₩125.60 Billion
≈ $85.12 Million
₩6.68 Billion
≈ $4.53 Million
0.053x -1.20%
2012-12-31 ₩138.32 Billion
≈ $93.74 Million
₩7.45 Billion
≈ $5.05 Million
0.054x -77.70%
2011-12-31 ₩149.68 Billion
≈ $101.44 Million
₩36.15 Billion
≈ $24.50 Million
0.242x -27.61%
2010-12-31 ₩100.72 Billion
≈ $68.25 Million
₩33.60 Billion
≈ $22.77 Million
0.334x +15.53%
2009-12-31 ₩58.90 Billion
≈ $39.92 Million
₩17.01 Billion
≈ $11.53 Million
0.289x -15.12%
2008-12-31 ₩45.48 Billion
≈ $30.82 Million
₩15.47 Billion
≈ $10.49 Million
0.340x --

About HANA Micron Inc

KQ:067310 Korea Semiconductors & Semiconductor Equipment
Market Cap
$629.38 Million
₩928.72 Billion KRW
Market Cap Rank
#11141 Global
#295 in Korea
Share Price
₩37600.00
Change (1 day)
+7.58%
52-Week Range
₩19730.00 - ₩56800.00
All Time High
₩56800.00
About

HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA,… Read more