HANA Micron Inc (067310) - Cash Flow Conversion Efficiency
Based on the latest financial reports, HANA Micron Inc (067310) has a cash flow conversion efficiency ratio of -0.039x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩-24.09 Billion ≈ $-16.33 Million USD) by net assets (₩613.46 Billion ≈ $415.74 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. Also see 067310 company net worth for the company's overall valuation and market capitalisation.
HANA Micron Inc - Cash Flow Conversion Efficiency Trend (2008–2024)
This chart illustrates how HANA Micron Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data.
HANA Micron Inc Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of HANA Micron Inc ranked by their cash flow conversion efficiency. Explore 067310 cash flow quality score to measure how well operating cash flow supports reported net income.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
China Building Material
SHG:603060
|
0.043x |
|
Wuhan Sanzhen Industry Holding Co Ltd
SHG:600168
|
0.023x |
|
MN Holdings Berhad
KLSE:0245
|
-0.055x |
|
SEC Electric Mach Co Ltd
SHG:603988
|
0.015x |
|
Lotte Tour Dev
KO:032350
|
-0.024x |
|
Turaco Gold Ltd
AU:TCG
|
-0.146x |
|
Hudson Pacific Properties Inc
NYSE:HPP
|
0.010x |
|
Giti Tire Corp
SHG:600182
|
0.076x |
Annual Cash Flow Conversion Efficiency for HANA Micron Inc (2008–2024)
The table below shows the annual cash flow conversion efficiency of HANA Micron Inc from 2008 to 2024. View today's stock price for HANA Micron Inc for real-time trading data and today's change.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2024-12-31 | ₩605.83 Billion ≈ $410.56 Million |
₩40.97 Billion ≈ $27.77 Million |
0.068x | -55.70% |
| 2023-12-31 | ₩544.39 Billion ≈ $368.92 Million |
₩83.12 Billion ≈ $56.33 Million |
0.153x | -68.97% |
| 2022-12-31 | ₩264.11 Billion ≈ $178.98 Million |
₩129.96 Billion ≈ $88.07 Million |
0.492x | -9.37% |
| 2021-12-31 | ₩274.87 Billion ≈ $186.28 Million |
₩149.23 Billion ≈ $101.13 Million |
0.543x | -9.57% |
| 2020-12-31 | ₩137.89 Billion ≈ $93.45 Million |
₩82.78 Billion ≈ $56.10 Million |
0.600x | +21.01% |
| 2019-12-31 | ₩144.96 Billion ≈ $98.24 Million |
₩71.92 Billion ≈ $48.74 Million |
0.496x | +47.99% |
| 2018-12-31 | ₩133.94 Billion ≈ $90.77 Million |
₩44.90 Billion ≈ $30.43 Million |
0.335x | +14.89% |
| 2017-12-31 | ₩131.69 Billion ≈ $89.25 Million |
₩38.43 Billion ≈ $26.04 Million |
0.292x | +6.68% |
| 2016-12-31 | ₩120.63 Billion ≈ $81.75 Million |
₩32.99 Billion ≈ $22.36 Million |
0.274x | +179.00% |
| 2015-12-31 | ₩137.54 Billion ≈ $93.21 Million |
₩13.48 Billion ≈ $9.14 Million |
0.098x | -71.35% |
| 2014-12-31 | ₩139.75 Billion ≈ $94.70 Million |
₩47.81 Billion ≈ $32.40 Million |
0.342x | +542.99% |
| 2013-12-31 | ₩125.60 Billion ≈ $85.12 Million |
₩6.68 Billion ≈ $4.53 Million |
0.053x | -1.20% |
| 2012-12-31 | ₩138.32 Billion ≈ $93.74 Million |
₩7.45 Billion ≈ $5.05 Million |
0.054x | -77.70% |
| 2011-12-31 | ₩149.68 Billion ≈ $101.44 Million |
₩36.15 Billion ≈ $24.50 Million |
0.242x | -27.61% |
| 2010-12-31 | ₩100.72 Billion ≈ $68.25 Million |
₩33.60 Billion ≈ $22.77 Million |
0.334x | +15.53% |
| 2009-12-31 | ₩58.90 Billion ≈ $39.92 Million |
₩17.01 Billion ≈ $11.53 Million |
0.289x | -15.12% |
| 2008-12-31 | ₩45.48 Billion ≈ $30.82 Million |
₩15.47 Billion ≈ $10.49 Million |
0.340x | -- |
About HANA Micron Inc
HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA,… Read more