HANA Micron Inc (067310) - Cash Flow Conversion Efficiency
Based on the latest financial reports, HANA Micron Inc (067310) has a cash flow conversion efficiency ratio of -0.039x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩-24.09 Billion ≈ $-16.33 Million USD) by net assets (₩613.46 Billion ≈ $415.74 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See HANA Micron Inc (067310) balance sheet quality index to measure how much of total assets are equity-financed.
HANA Micron Inc - Cash Flow Conversion Efficiency Trend (2008–2024)
This chart illustrates how HANA Micron Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data. Check 067310 operating cash flow to net income to evaluate the quality of earnings relative to operating cash generation.
HANA Micron Inc Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of HANA Micron Inc ranked by their cash flow conversion efficiency.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Compagnie du Bois Sauvage SA
BR:COMB
|
0.093x |
|
Guangdong Fangyuan Environment Co. Ltd. A
SHG:688148
|
N/A |
|
Union Optech Co Ltd
SHE:300691
|
0.002x |
|
Hind Rectifiers Limited
NSE:HIRECT
|
0.333x |
|
Wuhan Easy Diagnosis Biomedicine Co Ltd Class A
SHE:002932
|
0.003x |
|
YLZ Information Tech Co
SHE:300096
|
-0.049x |
|
Hunan Hansen Pharmaceutical Co Ltd
SHE:002412
|
0.022x |
|
Chrysos Corporation Ltd
AU:C79
|
0.032x |
Annual Cash Flow Conversion Efficiency for HANA Micron Inc (2008–2024)
The table below shows the annual cash flow conversion efficiency of HANA Micron Inc from 2008 to 2024. For the full company profile with market capitalisation and key ratios, see market value of HANA Micron Inc.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2024-12-31 | ₩605.83 Billion ≈ $410.56 Million |
₩40.97 Billion ≈ $27.77 Million |
0.068x | -55.70% |
| 2023-12-31 | ₩544.39 Billion ≈ $368.92 Million |
₩83.12 Billion ≈ $56.33 Million |
0.153x | -68.97% |
| 2022-12-31 | ₩264.11 Billion ≈ $178.98 Million |
₩129.96 Billion ≈ $88.07 Million |
0.492x | -9.37% |
| 2021-12-31 | ₩274.87 Billion ≈ $186.28 Million |
₩149.23 Billion ≈ $101.13 Million |
0.543x | -9.57% |
| 2020-12-31 | ₩137.89 Billion ≈ $93.45 Million |
₩82.78 Billion ≈ $56.10 Million |
0.600x | +21.01% |
| 2019-12-31 | ₩144.96 Billion ≈ $98.24 Million |
₩71.92 Billion ≈ $48.74 Million |
0.496x | +47.99% |
| 2018-12-31 | ₩133.94 Billion ≈ $90.77 Million |
₩44.90 Billion ≈ $30.43 Million |
0.335x | +14.89% |
| 2017-12-31 | ₩131.69 Billion ≈ $89.25 Million |
₩38.43 Billion ≈ $26.04 Million |
0.292x | +6.68% |
| 2016-12-31 | ₩120.63 Billion ≈ $81.75 Million |
₩32.99 Billion ≈ $22.36 Million |
0.274x | +179.00% |
| 2015-12-31 | ₩137.54 Billion ≈ $93.21 Million |
₩13.48 Billion ≈ $9.14 Million |
0.098x | -71.35% |
| 2014-12-31 | ₩139.75 Billion ≈ $94.70 Million |
₩47.81 Billion ≈ $32.40 Million |
0.342x | +542.99% |
| 2013-12-31 | ₩125.60 Billion ≈ $85.12 Million |
₩6.68 Billion ≈ $4.53 Million |
0.053x | -1.20% |
| 2012-12-31 | ₩138.32 Billion ≈ $93.74 Million |
₩7.45 Billion ≈ $5.05 Million |
0.054x | -77.70% |
| 2011-12-31 | ₩149.68 Billion ≈ $101.44 Million |
₩36.15 Billion ≈ $24.50 Million |
0.242x | -27.61% |
| 2010-12-31 | ₩100.72 Billion ≈ $68.25 Million |
₩33.60 Billion ≈ $22.77 Million |
0.334x | +15.53% |
| 2009-12-31 | ₩58.90 Billion ≈ $39.92 Million |
₩17.01 Billion ≈ $11.53 Million |
0.289x | -15.12% |
| 2008-12-31 | ₩45.48 Billion ≈ $30.82 Million |
₩15.47 Billion ≈ $10.49 Million |
0.340x | -- |
About HANA Micron Inc
HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA,… Read more