HANA Micron Inc (067310) - Cash Flow Conversion Efficiency

Latest as of September 2025: -0.039x

Based on the latest financial reports, HANA Micron Inc (067310) has a cash flow conversion efficiency ratio of -0.039x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩-24.09 Billion ≈ $-16.33 Million USD) by net assets (₩613.46 Billion ≈ $415.74 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See HANA Micron Inc (067310) balance sheet quality index to measure how much of total assets are equity-financed.

HANA Micron Inc - Cash Flow Conversion Efficiency Trend (2008–2024)

This chart illustrates how HANA Micron Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data. Check 067310 operating cash flow to net income to evaluate the quality of earnings relative to operating cash generation.

HANA Micron Inc Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of HANA Micron Inc ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Compagnie du Bois Sauvage SA
BR:COMB
0.093x
Guangdong Fangyuan Environment Co. Ltd. A
SHG:688148
N/A
Union Optech Co Ltd
SHE:300691
0.002x
Hind Rectifiers Limited
NSE:HIRECT
0.333x
Wuhan Easy Diagnosis Biomedicine Co Ltd Class A
SHE:002932
0.003x
YLZ Information Tech Co
SHE:300096
-0.049x
Hunan Hansen Pharmaceutical Co Ltd
SHE:002412
0.022x
Chrysos Corporation Ltd
AU:C79
0.032x

Annual Cash Flow Conversion Efficiency for HANA Micron Inc (2008–2024)

The table below shows the annual cash flow conversion efficiency of HANA Micron Inc from 2008 to 2024. For the full company profile with market capitalisation and key ratios, see market value of HANA Micron Inc.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2024-12-31 ₩605.83 Billion
≈ $410.56 Million
₩40.97 Billion
≈ $27.77 Million
0.068x -55.70%
2023-12-31 ₩544.39 Billion
≈ $368.92 Million
₩83.12 Billion
≈ $56.33 Million
0.153x -68.97%
2022-12-31 ₩264.11 Billion
≈ $178.98 Million
₩129.96 Billion
≈ $88.07 Million
0.492x -9.37%
2021-12-31 ₩274.87 Billion
≈ $186.28 Million
₩149.23 Billion
≈ $101.13 Million
0.543x -9.57%
2020-12-31 ₩137.89 Billion
≈ $93.45 Million
₩82.78 Billion
≈ $56.10 Million
0.600x +21.01%
2019-12-31 ₩144.96 Billion
≈ $98.24 Million
₩71.92 Billion
≈ $48.74 Million
0.496x +47.99%
2018-12-31 ₩133.94 Billion
≈ $90.77 Million
₩44.90 Billion
≈ $30.43 Million
0.335x +14.89%
2017-12-31 ₩131.69 Billion
≈ $89.25 Million
₩38.43 Billion
≈ $26.04 Million
0.292x +6.68%
2016-12-31 ₩120.63 Billion
≈ $81.75 Million
₩32.99 Billion
≈ $22.36 Million
0.274x +179.00%
2015-12-31 ₩137.54 Billion
≈ $93.21 Million
₩13.48 Billion
≈ $9.14 Million
0.098x -71.35%
2014-12-31 ₩139.75 Billion
≈ $94.70 Million
₩47.81 Billion
≈ $32.40 Million
0.342x +542.99%
2013-12-31 ₩125.60 Billion
≈ $85.12 Million
₩6.68 Billion
≈ $4.53 Million
0.053x -1.20%
2012-12-31 ₩138.32 Billion
≈ $93.74 Million
₩7.45 Billion
≈ $5.05 Million
0.054x -77.70%
2011-12-31 ₩149.68 Billion
≈ $101.44 Million
₩36.15 Billion
≈ $24.50 Million
0.242x -27.61%
2010-12-31 ₩100.72 Billion
≈ $68.25 Million
₩33.60 Billion
≈ $22.77 Million
0.334x +15.53%
2009-12-31 ₩58.90 Billion
≈ $39.92 Million
₩17.01 Billion
≈ $11.53 Million
0.289x -15.12%
2008-12-31 ₩45.48 Billion
≈ $30.82 Million
₩15.47 Billion
≈ $10.49 Million
0.340x --

About HANA Micron Inc

KQ:067310 Korea Semiconductors & Semiconductor Equipment
Market Cap
$497.14 Million
₩733.59 Billion KRW
Market Cap Rank
#12053 Global
#312 in Korea
Share Price
₩29700.00
Change (1 day)
+20.00%
52-Week Range
₩11580.00 - ₩56800.00
All Time High
₩56800.00
About

HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA,… Read more