HANA Micron Inc (067310) - Total Liabilities

Latest as of September 2025: ₩1.42 Trillion KRW ≈ $962.31 Million USD

Based on the latest financial reports, HANA Micron Inc (067310) has total liabilities worth ₩1.42 Trillion KRW (≈ $962.31 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

HANA Micron Inc - Total Liabilities Trend (2008–2024)

This chart illustrates how HANA Micron Inc's total liabilities have evolved over time, based on quarterly financial data. See 067310 working capital ratio to evaluate short-term liquidity relative to the company's equity base.

HANA Micron Inc Competitors by Total Liabilities

The table below lists competitors of HANA Micron Inc ranked by their total liabilities.

Company Country Total Liabilities
Shanghai Yongguan Adhesive Products Corp Ltd
SHG:603681
China CN¥4.14 Billion
Nanfang Ventilator Co Ltd
SHE:300004
China CN¥377.61 Million
Prashkovsky
TA:PRSK
Israel ILA4.72 Billion
IDI Insurance Company Ltd
TA:IDIN
Israel ILA5.52 Billion
Lenzing Aktiengesellschaft
VI:LNZ
Austria €3.31 Billion
Hang Xiao Steel Structure Co Ltd
SHG:600477
China CN¥10.09 Billion
ADITYA VISION LTD
NSE:AVL
India Rs5.61 Billion
Myers Industries Inc
NYSE:MYE
USA $547.86 Million

Liability Composition Analysis (2008–2024)

This chart breaks down HANA Micron Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see how much is HANA Micron Inc worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.85 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 3.78 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.70 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how HANA Micron Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for HANA Micron Inc (2008–2024)

The table below shows the annual total liabilities of HANA Micron Inc from 2008 to 2024.

Year Total Liabilities Change
2024-12-31 ₩1.34 Trillion
≈ $907.30 Million
+13.39%
2023-12-31 ₩1.18 Trillion
≈ $800.15 Million
+3.12%
2022-12-31 ₩1.14 Trillion
≈ $775.91 Million
+47.51%
2021-12-31 ₩776.17 Billion
≈ $526.00 Million
+23.80%
2020-12-31 ₩626.94 Billion
≈ $424.87 Million
+11.61%
2019-12-31 ₩561.74 Billion
≈ $380.68 Million
+19.27%
2018-12-31 ₩470.97 Billion
≈ $319.17 Million
+21.28%
2017-12-31 ₩388.34 Billion
≈ $263.17 Million
+34.89%
2016-12-31 ₩287.89 Billion
≈ $195.10 Million
+11.93%
2015-12-31 ₩257.21 Billion
≈ $174.31 Million
+4.89%
2014-12-31 ₩245.22 Billion
≈ $166.18 Million
+1.10%
2013-12-31 ₩242.54 Billion
≈ $164.37 Million
+40.92%
2012-12-31 ₩172.11 Billion
≈ $116.64 Million
+11.48%
2011-12-31 ₩154.39 Billion
≈ $104.63 Million
-23.98%
2010-12-31 ₩203.10 Billion
≈ $137.64 Million
+25.83%
2009-12-31 ₩161.41 Billion
≈ $109.39 Million
+16.67%
2008-12-31 ₩138.34 Billion
≈ $93.75 Million
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About HANA Micron Inc

KQ:067310 Korea Semiconductors & Semiconductor Equipment
Market Cap
$863.72 Million
₩1.27 Trillion KRW
Market Cap Rank
#9729 Global
#264 in Korea
Share Price
₩51600.00
Change (1 day)
+1.78%
52-Week Range
₩10650.00 - ₩54500.00
All Time High
₩54500.00
About

HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA,… Read more