HANA Micron Inc (067310) - Total Liabilities
Based on the latest financial reports, HANA Micron Inc (067310) has total liabilities worth ₩1.42 Trillion KRW (≈ $962.31 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
HANA Micron Inc - Total Liabilities Trend (2008–2024)
This chart illustrates how HANA Micron Inc's total liabilities have evolved over time, based on quarterly financial data. See 067310 working capital ratio to evaluate short-term liquidity relative to the company's equity base.
HANA Micron Inc Competitors by Total Liabilities
The table below lists competitors of HANA Micron Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Shanghai Yongguan Adhesive Products Corp Ltd
SHG:603681
|
China | CN¥4.14 Billion |
|
Nanfang Ventilator Co Ltd
SHE:300004
|
China | CN¥377.61 Million |
|
Prashkovsky
TA:PRSK
|
Israel | ILA4.72 Billion |
|
IDI Insurance Company Ltd
TA:IDIN
|
Israel | ILA5.52 Billion |
|
Lenzing Aktiengesellschaft
VI:LNZ
|
Austria | €3.31 Billion |
|
Hang Xiao Steel Structure Co Ltd
SHG:600477
|
China | CN¥10.09 Billion |
|
ADITYA VISION LTD
NSE:AVL
|
India | Rs5.61 Billion |
|
Myers Industries Inc
NYSE:MYE
|
USA | $547.86 Million |
Liability Composition Analysis (2008–2024)
This chart breaks down HANA Micron Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see how much is HANA Micron Inc worth.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.85 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 3.78 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.70 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how HANA Micron Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for HANA Micron Inc (2008–2024)
The table below shows the annual total liabilities of HANA Micron Inc from 2008 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | ₩1.34 Trillion ≈ $907.30 Million |
+13.39% |
| 2023-12-31 | ₩1.18 Trillion ≈ $800.15 Million |
+3.12% |
| 2022-12-31 | ₩1.14 Trillion ≈ $775.91 Million |
+47.51% |
| 2021-12-31 | ₩776.17 Billion ≈ $526.00 Million |
+23.80% |
| 2020-12-31 | ₩626.94 Billion ≈ $424.87 Million |
+11.61% |
| 2019-12-31 | ₩561.74 Billion ≈ $380.68 Million |
+19.27% |
| 2018-12-31 | ₩470.97 Billion ≈ $319.17 Million |
+21.28% |
| 2017-12-31 | ₩388.34 Billion ≈ $263.17 Million |
+34.89% |
| 2016-12-31 | ₩287.89 Billion ≈ $195.10 Million |
+11.93% |
| 2015-12-31 | ₩257.21 Billion ≈ $174.31 Million |
+4.89% |
| 2014-12-31 | ₩245.22 Billion ≈ $166.18 Million |
+1.10% |
| 2013-12-31 | ₩242.54 Billion ≈ $164.37 Million |
+40.92% |
| 2012-12-31 | ₩172.11 Billion ≈ $116.64 Million |
+11.48% |
| 2011-12-31 | ₩154.39 Billion ≈ $104.63 Million |
-23.98% |
| 2010-12-31 | ₩203.10 Billion ≈ $137.64 Million |
+25.83% |
| 2009-12-31 | ₩161.41 Billion ≈ $109.39 Million |
+16.67% |
| 2008-12-31 | ₩138.34 Billion ≈ $93.75 Million |
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About HANA Micron Inc
HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA,… Read more