Phoenix Silicon International Corp (8028) - Cash Flow Conversion Efficiency

Latest as of December 2025: 0.080x

Based on the latest financial reports, Phoenix Silicon International Corp (8028) has a cash flow conversion efficiency ratio of 0.080x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (NT$410.20 Million ≈ $12.92 Million USD) by net assets (NT$5.11 Billion ≈ $160.93 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. Also see Phoenix Silicon International Corp stock valuation for the company's overall valuation and market capitalisation.

Phoenix Silicon International Corp - Cash Flow Conversion Efficiency Trend (2011–2025)

This chart illustrates how Phoenix Silicon International Corp's cash flow conversion efficiency has evolved over time, based on yearly financial data.

Phoenix Silicon International Corp Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Phoenix Silicon International Corp ranked by their cash flow conversion efficiency. Explore 8028 cash flow quality score to measure how well operating cash flow supports reported net income.

Company Cash Flow Conversion Efficiency
Rio2 Ltd
TO:RIO
0.266x
ATAI LIFE SCIENCES BV EO1
F:9VC
N/A
Guangdong Yizumi Precision Machinery Co Ltd
SHE:300415
-0.009x
Sichuan Chengfei Integration Technology Corp Ltd
SHE:002190
0.034x
Cuprum
SN:CUPRUM
0.040x
China National Electric Apparatus R
SHG:688128
0.101x
Bega Cheese Ltd
AU:BGA
0.170x
Hisense Home Appliances Group Co. Ltd
F:GKE
0.212x

Annual Cash Flow Conversion Efficiency for Phoenix Silicon International Corp (2011–2025)

The table below shows the annual cash flow conversion efficiency of Phoenix Silicon International Corp from 2011 to 2025. View 8028 stock price for real-time trading data and today's change.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2025-12-31 NT$5.11 Billion
≈ $160.93 Million
NT$1.40 Billion
≈ $44.14 Million
0.274x -24.28%
2024-12-31 NT$4.12 Billion
≈ $129.70 Million
NT$1.49 Billion
≈ $46.99 Million
0.362x +107.63%
2023-12-31 NT$3.94 Billion
≈ $123.99 Million
NT$686.65 Million
≈ $21.63 Million
0.174x -32.66%
2022-12-31 NT$2.99 Billion
≈ $94.24 Million
NT$775.06 Million
≈ $24.42 Million
0.259x -3.80%
2021-12-31 NT$2.52 Billion
≈ $79.30 Million
NT$677.94 Million
≈ $21.36 Million
0.269x +12.49%
2020-12-31 NT$2.32 Billion
≈ $73.22 Million
NT$556.40 Million
≈ $17.53 Million
0.239x -12.91%
2019-12-31 NT$2.47 Billion
≈ $77.90 Million
NT$679.75 Million
≈ $21.42 Million
0.275x +14.24%
2018-12-31 NT$2.24 Billion
≈ $70.53 Million
NT$538.75 Million
≈ $16.97 Million
0.241x -21.01%
2017-12-31 NT$1.60 Billion
≈ $50.44 Million
NT$487.73 Million
≈ $15.37 Million
0.305x -1.12%
2016-12-31 NT$1.61 Billion
≈ $50.75 Million
NT$496.28 Million
≈ $15.64 Million
0.308x +67.19%
2015-12-31 NT$1.60 Billion
≈ $50.39 Million
NT$294.70 Million
≈ $9.28 Million
0.184x -49.93%
2014-12-31 NT$1.54 Billion
≈ $48.38 Million
NT$565.12 Million
≈ $17.80 Million
0.368x -17.54%
2013-12-31 NT$913.55 Million
≈ $28.78 Million
NT$407.73 Million
≈ $12.85 Million
0.446x -75.80%
2012-12-31 NT$199.71 Million
≈ $6.29 Million
NT$368.32 Million
≈ $11.60 Million
1.844x +137.13%
2011-12-31 NT$-43.19 Million
≈ $-1.36 Million
NT$214.56 Million
≈ $6.76 Million
-4.967x --

About Phoenix Silicon International Corp

TW:8028 Taiwan Semiconductor Equipment & Materials
Market Cap
$1.29 Billion
NT$40.84 Billion TWD
Market Cap Rank
#7829 Global
#248 in Taiwan
Share Price
NT$233.00
Change (1 day)
+2.87%
52-Week Range
NT$146.00 - NT$356.50
All Time High
NT$356.50
About

Phoenix Silicon International Corporation engages in the wafer process service development, wafering, and wafer thinning businesses in Taiwan. It offers wafer reclaim process services and new test wafer products for semiconductor IC manufacturing process monitoring; and wafer thinning products for conduction resistance and ultra-thin wafer, as well as metal film deposition and etching process for… Read more